JPS5667763U - - Google Patents

Info

Publication number
JPS5667763U
JPS5667763U JP15036279U JP15036279U JPS5667763U JP S5667763 U JPS5667763 U JP S5667763U JP 15036279 U JP15036279 U JP 15036279U JP 15036279 U JP15036279 U JP 15036279U JP S5667763 U JPS5667763 U JP S5667763U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15036279U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15036279U priority Critical patent/JPS5667763U/ja
Publication of JPS5667763U publication Critical patent/JPS5667763U/ja
Pending legal-status Critical Current

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  • Lead Frames For Integrated Circuits (AREA)
JP15036279U 1979-10-30 1979-10-30 Pending JPS5667763U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15036279U JPS5667763U (ja) 1979-10-30 1979-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15036279U JPS5667763U (ja) 1979-10-30 1979-10-30

Publications (1)

Publication Number Publication Date
JPS5667763U true JPS5667763U (ja) 1981-06-05

Family

ID=29381397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15036279U Pending JPS5667763U (ja) 1979-10-30 1979-10-30

Country Status (1)

Country Link
JP (1) JPS5667763U (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249359A (ja) * 1987-04-06 1988-10-17 Seiko Epson Corp 樹脂封止型半導体装置用リードフレーム
JP2014053461A (ja) * 2012-09-07 2014-03-20 Renesas Electronics Corp 半導体装置の製造方法および半導体装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63249359A (ja) * 1987-04-06 1988-10-17 Seiko Epson Corp 樹脂封止型半導体装置用リードフレーム
JP2014053461A (ja) * 2012-09-07 2014-03-20 Renesas Electronics Corp 半導体装置の製造方法および半導体装置

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