JPS5658886U - - Google Patents

Info

Publication number
JPS5658886U
JPS5658886U JP12539280U JP12539280U JPS5658886U JP S5658886 U JPS5658886 U JP S5658886U JP 12539280 U JP12539280 U JP 12539280U JP 12539280 U JP12539280 U JP 12539280U JP S5658886 U JPS5658886 U JP S5658886U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12539280U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12539280U priority Critical patent/JPS5658886U/ja
Publication of JPS5658886U publication Critical patent/JPS5658886U/ja
Pending legal-status Critical Current

Links

Classifications

    • H10W90/754
    • H10W90/756

Landscapes

  • Wire Bonding (AREA)
  • Electric Clocks (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP12539280U 1980-09-03 1980-09-03 Pending JPS5658886U (cg-RX-API-DMAC10.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12539280U JPS5658886U (cg-RX-API-DMAC10.html) 1980-09-03 1980-09-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12539280U JPS5658886U (cg-RX-API-DMAC10.html) 1980-09-03 1980-09-03

Publications (1)

Publication Number Publication Date
JPS5658886U true JPS5658886U (cg-RX-API-DMAC10.html) 1981-05-20

Family

ID=29357285

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12539280U Pending JPS5658886U (cg-RX-API-DMAC10.html) 1980-09-03 1980-09-03

Country Status (1)

Country Link
JP (1) JPS5658886U (cg-RX-API-DMAC10.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975374A (cg-RX-API-DMAC10.html) * 1972-11-22 1974-07-20
JPS5014248A (cg-RX-API-DMAC10.html) * 1973-06-06 1975-02-14
JPS50139365A (cg-RX-API-DMAC10.html) * 1974-04-26 1975-11-07

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4975374A (cg-RX-API-DMAC10.html) * 1972-11-22 1974-07-20
JPS5014248A (cg-RX-API-DMAC10.html) * 1973-06-06 1975-02-14
JPS50139365A (cg-RX-API-DMAC10.html) * 1974-04-26 1975-11-07

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001094227A (ja) * 1999-09-20 2001-04-06 Shinko Electric Ind Co Ltd 半導体チップ実装用の配線基板と該基板を用いた半導体チップの実装方法

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