JPS5653031A - Multiple insert molding method - Google Patents

Multiple insert molding method

Info

Publication number
JPS5653031A
JPS5653031A JP12915679A JP12915679A JPS5653031A JP S5653031 A JPS5653031 A JP S5653031A JP 12915679 A JP12915679 A JP 12915679A JP 12915679 A JP12915679 A JP 12915679A JP S5653031 A JPS5653031 A JP S5653031A
Authority
JP
Japan
Prior art keywords
hoop member
edge parts
lower mold
mold
parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12915679A
Other languages
Japanese (ja)
Inventor
Haruyuki Koizumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Tateisi Electronics Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Tateisi Electronics Co filed Critical Omron Tateisi Electronics Co
Priority to JP12915679A priority Critical patent/JPS5653031A/en
Publication of JPS5653031A publication Critical patent/JPS5653031A/en
Pending legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE: To enhance the precision of the relative positions of insert members and conduct the insert molding continuously and automatically by a method wherein a plate-shaped insert member to be placed at the uppermost position is laminated at the uppermost position in the state of a hoop member, and the laminate is demolded and carried by utilizing the edge portions of the hoop member.
CONSTITUTION: After completion of the inserting and laminating step, an upper electrode 5 is placed while positioning it so that its guide recesses 52 engage with guide pins 62. The upper electrode 5 is inserted as a hoop member such that it is connected to the edge parts 56 through connecting parts 55. The connecting parts 55 are positioned in the rcesses 65 of the lower mold 6, and the pilot holes 54 provided in the edge parts 56 are engaged with the pilot pins 64 of the lower mold 6, whereby the hoop member is positioned. After the plate-shaped insert members 1W5 are laminated and positioned, the upper mold is placed on the lower mold 6 and the mold is clamped. After molding, the molded form is in the stage of continuous integrity being connected by the edge parts 56, and it is demolded and carried by utilizing the edge parts 56.
COPYRIGHT: (C)1981,JPO&Japio
JP12915679A 1979-10-05 1979-10-05 Multiple insert molding method Pending JPS5653031A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12915679A JPS5653031A (en) 1979-10-05 1979-10-05 Multiple insert molding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12915679A JPS5653031A (en) 1979-10-05 1979-10-05 Multiple insert molding method

Publications (1)

Publication Number Publication Date
JPS5653031A true JPS5653031A (en) 1981-05-12

Family

ID=15002518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12915679A Pending JPS5653031A (en) 1979-10-05 1979-10-05 Multiple insert molding method

Country Status (1)

Country Link
JP (1) JPS5653031A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1394521A1 (en) * 2002-08-07 2004-03-03 Omron Co., Ltd. Small capacitive pressure sensor with insert molding, moving electrode and diaphragm

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1394521A1 (en) * 2002-08-07 2004-03-03 Omron Co., Ltd. Small capacitive pressure sensor with insert molding, moving electrode and diaphragm

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