JPS5651832A - Method and apparatus for wire bonding - Google Patents

Method and apparatus for wire bonding

Info

Publication number
JPS5651832A
JPS5651832A JP12683979A JP12683979A JPS5651832A JP S5651832 A JPS5651832 A JP S5651832A JP 12683979 A JP12683979 A JP 12683979A JP 12683979 A JP12683979 A JP 12683979A JP S5651832 A JPS5651832 A JP S5651832A
Authority
JP
Japan
Prior art keywords
bonding
wedge
wire bonding
time
sooner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12683979A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6142860B2 (enExample
Inventor
Kazuhisa Takashima
Tokio Iguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Tokyo Electronics Co Ltd
Hitachi Ltd
Hitachi Ome Electronic Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Tokyo Electronics Co Ltd, Hitachi Ltd, Hitachi Ome Electronic Co Ltd filed Critical Hitachi Tokyo Electronics Co Ltd
Priority to JP12683979A priority Critical patent/JPS5651832A/ja
Publication of JPS5651832A publication Critical patent/JPS5651832A/ja
Publication of JPS6142860B2 publication Critical patent/JPS6142860B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07531—Techniques
    • H10W72/07532—Compression bonding, e.g. thermocompression bonding
    • H10W72/07533—Ultrasonic bonding, e.g. thermosonic bonding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP12683979A 1979-10-03 1979-10-03 Method and apparatus for wire bonding Granted JPS5651832A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12683979A JPS5651832A (en) 1979-10-03 1979-10-03 Method and apparatus for wire bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12683979A JPS5651832A (en) 1979-10-03 1979-10-03 Method and apparatus for wire bonding

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP60172342A Division JPS61105852A (ja) 1985-08-07 1985-08-07 ワイヤボンダ

Publications (2)

Publication Number Publication Date
JPS5651832A true JPS5651832A (en) 1981-05-09
JPS6142860B2 JPS6142860B2 (enExample) 1986-09-24

Family

ID=14945158

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12683979A Granted JPS5651832A (en) 1979-10-03 1979-10-03 Method and apparatus for wire bonding

Country Status (1)

Country Link
JP (1) JPS5651832A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115336A (ja) * 1984-06-30 1986-01-23 Toshiba Corp ワイヤボンデイング方法
JPS61105852A (ja) * 1985-08-07 1986-05-23 Hitachi Ltd ワイヤボンダ
JPS6230341A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd ワイヤボンデイング方法
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6236850A (ja) * 1985-08-12 1987-02-17 Nippon Telegr & Teleph Corp <Ntt> 相補型ｍｉｓ半導体集積回路
JPS62244163A (ja) * 1986-04-16 1987-10-24 Nec Corp 半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5438766A (en) * 1977-09-02 1979-03-23 Hitachi Ltd Ultrasonic wire bonding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5438766A (en) * 1977-09-02 1979-03-23 Hitachi Ltd Ultrasonic wire bonding device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6115336A (ja) * 1984-06-30 1986-01-23 Toshiba Corp ワイヤボンデイング方法
JPS6230341A (ja) * 1985-07-31 1987-02-09 Fujitsu Ltd ワイヤボンデイング方法
JPS61105852A (ja) * 1985-08-07 1986-05-23 Hitachi Ltd ワイヤボンダ
JPH0388344A (ja) * 1989-08-31 1991-04-12 Seiko Epson Corp インナーリードのボンディング方法

Also Published As

Publication number Publication date
JPS6142860B2 (enExample) 1986-09-24

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