JPS56500112A - - Google Patents
Info
- Publication number
- JPS56500112A JPS56500112A JP50071380A JP50071380A JPS56500112A JP S56500112 A JPS56500112 A JP S56500112A JP 50071380 A JP50071380 A JP 50071380A JP 50071380 A JP50071380 A JP 50071380A JP S56500112 A JPS56500112 A JP S56500112A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/30—Die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/02—Manufacture or treatment of conductive package substrates serving as an interconnection, e.g. of metal plates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/20—Conductive package substrates serving as an interconnection, e.g. metal plates
- H10W70/22—Conductive package substrates serving as an interconnection, e.g. metal plates having an heterogeneous or anisotropic structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
- H10W72/07331—Connecting techniques
- H10W72/07336—Soldering or alloying
Landscapes
- Pressure Welding/Diffusion-Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US1865379A | 1979-03-08 | 1979-03-08 | |
| US1922479A | 1979-03-09 | 1979-03-09 | |
| US06/019,294 US4257156A (en) | 1979-03-09 | 1979-03-09 | Method for thermo-compression diffusion bonding each side of a substrateless semiconductor device wafer to respective structured copper strain buffers |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56500112A true JPS56500112A (cg-RX-API-DMAC10.html) | 1981-02-05 |
| JPS6142430B2 JPS6142430B2 (cg-RX-API-DMAC10.html) | 1986-09-20 |
Family
ID=27361063
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55500713A Expired JPS6142430B2 (cg-RX-API-DMAC10.html) | 1979-03-08 | 1980-03-05 |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP0025057B1 (cg-RX-API-DMAC10.html) |
| JP (1) | JPS6142430B2 (cg-RX-API-DMAC10.html) |
| DE (1) | DE3070263D1 (cg-RX-API-DMAC10.html) |
| WO (1) | WO1980001967A1 (cg-RX-API-DMAC10.html) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19843309A1 (de) * | 1998-09-22 | 2000-03-23 | Asea Brown Boveri | Kurzschlussfestes IGBT Modul |
| EP1246242A1 (de) * | 2001-03-26 | 2002-10-02 | Abb Research Ltd. | Kurzschlussfestes IGBT Modul |
| US20150047783A1 (en) * | 2012-03-19 | 2015-02-19 | Ev Group E. Thallner Gmbh | Pressure transfer plate for pressure transfer of a bonding pressure |
| US12644174B2 (en) | 2023-10-13 | 2026-06-02 | Solstice Advanced Materials Us, Inc. | Diffusion bonded tungsten containing target to titanium or titanium alloy backing plate |
| KR20260063233A (ko) * | 2024-10-30 | 2026-05-07 | 주식회사 포스코 | 열융착 장치 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1141029B (de) * | 1960-06-23 | 1962-12-13 | Siemens Ag | Halbleiteranordnung und Verfahren zu ihrer Herstellung |
| DE1153461B (de) * | 1960-06-23 | 1963-08-29 | Siemens Ag | Halbleiteranordnung |
| US3256598A (en) * | 1963-07-25 | 1966-06-21 | Martin Marietta Corp | Diffusion bonding |
| US3273029A (en) * | 1963-08-23 | 1966-09-13 | Hoffman Electronics Corp | Method of attaching leads to a semiconductor body and the article formed thereby |
| US3295089A (en) * | 1963-10-11 | 1966-12-27 | American Mach & Foundry | Semiconductor device |
| US3237272A (en) * | 1965-07-06 | 1966-03-01 | Motorola Inc | Method of making semiconductor device |
| GB1297046A (cg-RX-API-DMAC10.html) * | 1969-08-25 | 1972-11-22 | ||
| US3726466A (en) * | 1971-05-28 | 1973-04-10 | Alco Standard Corp | Brazing fixture |
| US3761783A (en) * | 1972-02-02 | 1973-09-25 | Sperry Rand Corp | Duel-mesa ring-shaped high frequency diode |
| US4071397A (en) * | 1973-07-02 | 1978-01-31 | Motorola, Inc. | Silicon metallographic etch |
| GB1457806A (en) * | 1974-03-04 | 1976-12-08 | Mullard Ltd | Semiconductor device manufacture |
| GB1532628A (en) * | 1974-11-15 | 1978-11-15 | Ass Eng Ltd | Metal bonding method |
| DE2514922C2 (de) * | 1975-04-05 | 1983-01-27 | SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg | Gegen thermische Wechselbelastung beständiges Halbleiterbauelement |
| SU622603A1 (ru) * | 1977-04-04 | 1978-09-05 | Предприятие П/Я В-2058 | Способ диффузионной сварки |
| US4089456A (en) * | 1977-06-28 | 1978-05-16 | United Technologies Corporation | Controlled-pressure diffusion bonding and fixture therefor |
| US4385310A (en) * | 1978-03-22 | 1983-05-24 | General Electric Company | Structured copper strain buffer |
| US4392153A (en) * | 1978-05-01 | 1983-07-05 | General Electric Company | Cooled semiconductor power module including structured strain buffers without dry interfaces |
-
1980
- 1980-03-05 JP JP55500713A patent/JPS6142430B2/ja not_active Expired
- 1980-03-05 WO PCT/US1980/000220 patent/WO1980001967A1/en not_active Ceased
- 1980-03-05 DE DE8080900618T patent/DE3070263D1/de not_active Expired
- 1980-09-24 EP EP80900618A patent/EP0025057B1/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6142430B2 (cg-RX-API-DMAC10.html) | 1986-09-20 |
| EP0025057A1 (en) | 1981-03-18 |
| EP0025057A4 (en) | 1981-10-27 |
| WO1980001967A1 (en) | 1980-09-18 |
| EP0025057B1 (en) | 1985-03-13 |
| DE3070263D1 (en) | 1985-04-18 |