JPS5648970B2 - - Google Patents

Info

Publication number
JPS5648970B2
JPS5648970B2 JP8457172A JP8457172A JPS5648970B2 JP S5648970 B2 JPS5648970 B2 JP S5648970B2 JP 8457172 A JP8457172 A JP 8457172A JP 8457172 A JP8457172 A JP 8457172A JP S5648970 B2 JPS5648970 B2 JP S5648970B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8457172A
Other languages
Japanese (ja)
Other versions
JPS4940864A (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8457172A priority Critical patent/JPS5648970B2/ja
Publication of JPS4940864A publication Critical patent/JPS4940864A/ja
Publication of JPS5648970B2 publication Critical patent/JPS5648970B2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP8457172A 1972-08-25 1972-08-25 Expired JPS5648970B2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8457172A JPS5648970B2 (enrdf_load_stackoverflow) 1972-08-25 1972-08-25

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8457172A JPS5648970B2 (enrdf_load_stackoverflow) 1972-08-25 1972-08-25

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP13883680A Division JPS5717140A (en) 1980-10-06 1980-10-06 Wire bonding device

Publications (2)

Publication Number Publication Date
JPS4940864A JPS4940864A (enrdf_load_stackoverflow) 1974-04-17
JPS5648970B2 true JPS5648970B2 (enrdf_load_stackoverflow) 1981-11-19

Family

ID=13834342

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8457172A Expired JPS5648970B2 (enrdf_load_stackoverflow) 1972-08-25 1972-08-25

Country Status (1)

Country Link
JP (1) JPS5648970B2 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5647697B2 (enrdf_load_stackoverflow) * 1973-06-26 1981-11-11
JPS52117380A (en) * 1976-03-29 1977-10-01 Toyo Ink Mfg Co Process for manufacturing laminated object
JPS5399288A (en) * 1977-02-10 1978-08-30 Nitto Electric Ind Co Ltd Flexible printed circuit board
JPS6050587B2 (ja) * 1977-07-15 1985-11-09 大阪曹達株式会社 ライニング方法
JP2507013Y2 (ja) * 1989-12-28 1996-08-14 日本電気株式会社 ワイヤ―ボンディング装置

Also Published As

Publication number Publication date
JPS4940864A (enrdf_load_stackoverflow) 1974-04-17

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Legal Events

Date Code Title Description
A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 19821221