JPS5645037A - Chip-type element mounter - Google Patents

Chip-type element mounter

Info

Publication number
JPS5645037A
JPS5645037A JP12065879A JP12065879A JPS5645037A JP S5645037 A JPS5645037 A JP S5645037A JP 12065879 A JP12065879 A JP 12065879A JP 12065879 A JP12065879 A JP 12065879A JP S5645037 A JPS5645037 A JP S5645037A
Authority
JP
Japan
Prior art keywords
chip
opening
plate
elements
scraping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12065879A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6311774B2 (enExample
Inventor
Masaaki Goto
Hitoshi Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12065879A priority Critical patent/JPS5645037A/ja
Publication of JPS5645037A publication Critical patent/JPS5645037A/ja
Publication of JPS6311774B2 publication Critical patent/JPS6311774B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
JP12065879A 1979-09-21 1979-09-21 Chip-type element mounter Granted JPS5645037A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12065879A JPS5645037A (en) 1979-09-21 1979-09-21 Chip-type element mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12065879A JPS5645037A (en) 1979-09-21 1979-09-21 Chip-type element mounter

Publications (2)

Publication Number Publication Date
JPS5645037A true JPS5645037A (en) 1981-04-24
JPS6311774B2 JPS6311774B2 (enExample) 1988-03-16

Family

ID=14791679

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12065879A Granted JPS5645037A (en) 1979-09-21 1979-09-21 Chip-type element mounter

Country Status (1)

Country Link
JP (1) JPS5645037A (enExample)

Also Published As

Publication number Publication date
JPS6311774B2 (enExample) 1988-03-16

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