JPS5642976U - - Google Patents
Info
- Publication number
- JPS5642976U JPS5642976U JP12349379U JP12349379U JPS5642976U JP S5642976 U JPS5642976 U JP S5642976U JP 12349379 U JP12349379 U JP 12349379U JP 12349379 U JP12349379 U JP 12349379U JP S5642976 U JPS5642976 U JP S5642976U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12349379U JPS592116Y2 (en) | 1979-09-05 | 1979-09-05 | plating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12349379U JPS592116Y2 (en) | 1979-09-05 | 1979-09-05 | plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5642976U true JPS5642976U (en) | 1981-04-18 |
| JPS592116Y2 JPS592116Y2 (en) | 1984-01-20 |
Family
ID=29355442
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12349379U Expired JPS592116Y2 (en) | 1979-09-05 | 1979-09-05 | plating equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592116Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006519932A (en) * | 2003-03-11 | 2006-08-31 | 株式会社荏原製作所 | Plating equipment |
| JP2010216006A (en) * | 2009-02-19 | 2010-09-30 | Denso Corp | Method for jet stream type plating, and device |
| KR101122793B1 (en) | 2009-11-09 | 2012-03-21 | 주식회사 케이씨텍 | Wafer plating apparatus |
| WO2019058860A1 (en) * | 2017-09-20 | 2019-03-28 | 上村工業株式会社 | Surface-treatment device and surface-treatment method |
-
1979
- 1979-09-05 JP JP12349379U patent/JPS592116Y2/en not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006519932A (en) * | 2003-03-11 | 2006-08-31 | 株式会社荏原製作所 | Plating equipment |
| JP4805141B2 (en) * | 2003-03-11 | 2011-11-02 | 株式会社荏原製作所 | Electroplating equipment |
| JP2010216006A (en) * | 2009-02-19 | 2010-09-30 | Denso Corp | Method for jet stream type plating, and device |
| KR101122793B1 (en) | 2009-11-09 | 2012-03-21 | 주식회사 케이씨텍 | Wafer plating apparatus |
| WO2019058860A1 (en) * | 2017-09-20 | 2019-03-28 | 上村工業株式会社 | Surface-treatment device and surface-treatment method |
| JP2019056137A (en) * | 2017-09-20 | 2019-04-11 | 上村工業株式会社 | Surface treatment device and surface treatment method |
| CN111094635A (en) * | 2017-09-20 | 2020-05-01 | 上村工业株式会社 | Surface treatment device and surface treatment method |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS592116Y2 (en) | 1984-01-20 |