JPS5640994B2 - - Google Patents
Info
- Publication number
- JPS5640994B2 JPS5640994B2 JP3321373A JP3321373A JPS5640994B2 JP S5640994 B2 JPS5640994 B2 JP S5640994B2 JP 3321373 A JP3321373 A JP 3321373A JP 3321373 A JP3321373 A JP 3321373A JP S5640994 B2 JPS5640994 B2 JP S5640994B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85909—Post-treatment of the connector or wire bonding area
- H01L2224/8592—Applying permanent coating, e.g. protective coating
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3321373A JPS5640994B2 (ko) | 1973-03-22 | 1973-03-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3321373A JPS5640994B2 (ko) | 1973-03-22 | 1973-03-22 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS49122292A JPS49122292A (ko) | 1974-11-22 |
| JPS5640994B2 true JPS5640994B2 (ko) | 1981-09-25 |
Family
ID=12380155
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3321373A Expired JPS5640994B2 (ko) | 1973-03-22 | 1973-03-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5640994B2 (ko) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW383508B (en) | 1996-07-29 | 2000-03-01 | Nichia Kagaku Kogyo Kk | Light emitting device and display |
| US5959316A (en) * | 1998-09-01 | 1999-09-28 | Hewlett-Packard Company | Multiple encapsulation of phosphor-LED devices |
| JP3775268B2 (ja) * | 2001-09-03 | 2006-05-17 | 日亜化学工業株式会社 | 発光装置の形成方法 |
| JP2005244259A (ja) * | 2005-05-23 | 2005-09-08 | Nichia Chem Ind Ltd | 発光ダイオード |
| KR20080049011A (ko) | 2005-08-05 | 2008-06-03 | 마쯔시다덴기산교 가부시키가이샤 | 반도체 발광장치 |
| JP5182399B2 (ja) * | 2011-07-20 | 2013-04-17 | 三菱化学株式会社 | 白色発光素子 |
| JP6326830B2 (ja) * | 2013-02-28 | 2018-05-23 | 日亜化学工業株式会社 | 発光装置及びそれを備える照明装置 |
-
1973
- 1973-03-22 JP JP3321373A patent/JPS5640994B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS49122292A (ko) | 1974-11-22 |