JPS563966Y2 - - Google Patents
Info
- Publication number
- JPS563966Y2 JPS563966Y2 JP9263776U JP9263776U JPS563966Y2 JP S563966 Y2 JPS563966 Y2 JP S563966Y2 JP 9263776 U JP9263776 U JP 9263776U JP 9263776 U JP9263776 U JP 9263776U JP S563966 Y2 JPS563966 Y2 JP S563966Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Die Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9263776U JPS563966Y2 (en:Method) | 1976-07-12 | 1976-07-12 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9263776U JPS563966Y2 (en:Method) | 1976-07-12 | 1976-07-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5311964U JPS5311964U (en:Method) | 1978-01-31 |
| JPS563966Y2 true JPS563966Y2 (en:Method) | 1981-01-28 |
Family
ID=28703226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9263776U Expired JPS563966Y2 (en:Method) | 1976-07-12 | 1976-07-12 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS563966Y2 (en:Method) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60149137U (ja) * | 1984-03-13 | 1985-10-03 | 株式会社東芝 | 樹脂封止型半導体装置 |
-
1976
- 1976-07-12 JP JP9263776U patent/JPS563966Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5311964U (en:Method) | 1978-01-31 |