JPS5635791A - Partial plating method - Google Patents

Partial plating method

Info

Publication number
JPS5635791A
JPS5635791A JP11011379A JP11011379A JPS5635791A JP S5635791 A JPS5635791 A JP S5635791A JP 11011379 A JP11011379 A JP 11011379A JP 11011379 A JP11011379 A JP 11011379A JP S5635791 A JPS5635791 A JP S5635791A
Authority
JP
Japan
Prior art keywords
plated
tape
sticked
resin
partial plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11011379A
Other languages
Japanese (ja)
Inventor
Mamoru Onda
Ryozo Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP11011379A priority Critical patent/JPS5635791A/en
Publication of JPS5635791A publication Critical patent/JPS5635791A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adhesive Tapes (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To improve partial plating method, by heating either a masking tape, formed by laminating a resin which easily softens and welds by heat and a resin which is relatively heat resistant, or a material to be plated before the laminated tape is sticked on the material to be plated.
CONSTITUTION: In partial plating of a material to be plated with a masking tape sticked on the material, a tape made by laminating a resin, which is easily softens and welds by heat, e.g., polyethylene, nylon etc., and a resin, which is relatively heat resistant, e.g., polyester, polyvinyl chloride, is used. Just before said laminated tape is sticked on the material to be plated, at least either the laminated tape or the material to be plated is heated, then the tape is sticked on the material. Hereby adherence of bonding agent at the end surface of metallic rod, or failure in bonding due to the inclusion of air bubbles is prevented.
COPYRIGHT: (C)1981,JPO&Japio
JP11011379A 1979-08-29 1979-08-29 Partial plating method Pending JPS5635791A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11011379A JPS5635791A (en) 1979-08-29 1979-08-29 Partial plating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11011379A JPS5635791A (en) 1979-08-29 1979-08-29 Partial plating method

Publications (1)

Publication Number Publication Date
JPS5635791A true JPS5635791A (en) 1981-04-08

Family

ID=14527364

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11011379A Pending JPS5635791A (en) 1979-08-29 1979-08-29 Partial plating method

Country Status (1)

Country Link
JP (1) JPS5635791A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081770A2 (en) * 1981-12-12 1983-06-22 Beiersdorf Aktiengesellschaft Masking strip for galvanic processes
JP2016113639A (en) * 2014-12-11 2016-06-23 凸版印刷株式会社 Etching method

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0081770A2 (en) * 1981-12-12 1983-06-22 Beiersdorf Aktiengesellschaft Masking strip for galvanic processes
JP2016113639A (en) * 2014-12-11 2016-06-23 凸版印刷株式会社 Etching method

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