JPS5634723A - Synthetic solder based on epoxy group - Google Patents

Synthetic solder based on epoxy group

Info

Publication number
JPS5634723A
JPS5634723A JP11717180A JP11717180A JPS5634723A JP S5634723 A JPS5634723 A JP S5634723A JP 11717180 A JP11717180 A JP 11717180A JP 11717180 A JP11717180 A JP 11717180A JP S5634723 A JPS5634723 A JP S5634723A
Authority
JP
Japan
Prior art keywords
epoxy group
solder based
synthetic
synthetic solder
epoxy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11717180A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249886B2 (enExample
Inventor
Sutaaringu Noorando Jieimuzu
Hajieku Mirosurabu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wyeth Holdings LLC
Original Assignee
American Cyanamid Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by American Cyanamid Co filed Critical American Cyanamid Co
Publication of JPS5634723A publication Critical patent/JPS5634723A/ja
Publication of JPS6249886B2 publication Critical patent/JPS6249886B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
  • Epoxy Resins (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP11717180A 1979-08-30 1980-08-27 Synthetic solder based on epoxy group Granted JPS5634723A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US7094879A 1979-08-30 1979-08-30

Publications (2)

Publication Number Publication Date
JPS5634723A true JPS5634723A (en) 1981-04-07
JPS6249886B2 JPS6249886B2 (enExample) 1987-10-21

Family

ID=22098327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11717180A Granted JPS5634723A (en) 1979-08-30 1980-08-27 Synthetic solder based on epoxy group

Country Status (1)

Country Link
JP (1) JPS5634723A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016138273A (ja) * 2007-11-14 2016-08-04 シーカ・テクノロジー・アーゲー 非芳香族尿素を反応促進剤として含む熱硬化性エポキシ樹脂組成物

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016138273A (ja) * 2007-11-14 2016-08-04 シーカ・テクノロジー・アーゲー 非芳香族尿素を反応促進剤として含む熱硬化性エポキシ樹脂組成物
US11198754B2 (en) 2007-11-14 2021-12-14 Sika Technology Ag Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator

Also Published As

Publication number Publication date
JPS6249886B2 (enExample) 1987-10-21

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