JPS5634723A - Synthetic solder based on epoxy group - Google Patents
Synthetic solder based on epoxy groupInfo
- Publication number
- JPS5634723A JPS5634723A JP11717180A JP11717180A JPS5634723A JP S5634723 A JPS5634723 A JP S5634723A JP 11717180 A JP11717180 A JP 11717180A JP 11717180 A JP11717180 A JP 11717180A JP S5634723 A JPS5634723 A JP S5634723A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy group
- solder based
- synthetic
- synthetic solder
- epoxy
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Epoxy Resins (AREA)
- Paints Or Removers (AREA)
- Adhesives Or Adhesive Processes (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US7094879A | 1979-08-30 | 1979-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5634723A true JPS5634723A (en) | 1981-04-07 |
JPS6249886B2 JPS6249886B2 (en) | 1987-10-21 |
Family
ID=22098327
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11717180A Granted JPS5634723A (en) | 1979-08-30 | 1980-08-27 | Synthetic solder based on epoxy group |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5634723A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
-
1980
- 1980-08-27 JP JP11717180A patent/JPS5634723A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016138273A (en) * | 2007-11-14 | 2016-08-04 | シーカ・テクノロジー・アーゲー | Heat-curing epoxy resin composition containing non-aromatic urea as accelerant |
US11198754B2 (en) | 2007-11-14 | 2021-12-14 | Sika Technology Ag | Heat-curing epoxy resin composition containing non-aromatic ureas as accelerator |
Also Published As
Publication number | Publication date |
---|---|
JPS6249886B2 (en) | 1987-10-21 |
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