JPS5633861B2 - - Google Patents
Info
- Publication number
- JPS5633861B2 JPS5633861B2 JP2108476A JP2108476A JPS5633861B2 JP S5633861 B2 JPS5633861 B2 JP S5633861B2 JP 2108476 A JP2108476 A JP 2108476A JP 2108476 A JP2108476 A JP 2108476A JP S5633861 B2 JPS5633861 B2 JP S5633861B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2108476A JPS52104868A (en) | 1976-03-01 | 1976-03-01 | Semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2108476A JPS52104868A (en) | 1976-03-01 | 1976-03-01 | Semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS52104868A JPS52104868A (en) | 1977-09-02 |
| JPS5633861B2 true JPS5633861B2 (show.php) | 1981-08-06 |
Family
ID=12045004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2108476A Granted JPS52104868A (en) | 1976-03-01 | 1976-03-01 | Semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS52104868A (show.php) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MX2021004830A (es) | 2018-11-14 | 2021-06-15 | Innovative Building Tech Llc | Sistema y metodo modular de hueco de escalera y hueco del elevador. |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5315609B2 (show.php) * | 1972-09-01 | 1978-05-26 | ||
| JPS5261479A (en) * | 1975-11-17 | 1977-05-20 | Mitsubishi Electric Corp | Production of semiconductor device |
-
1976
- 1976-03-01 JP JP2108476A patent/JPS52104868A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS52104868A (en) | 1977-09-02 |