JPS5633860A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5633860A
JPS5633860A JP10914479A JP10914479A JPS5633860A JP S5633860 A JPS5633860 A JP S5633860A JP 10914479 A JP10914479 A JP 10914479A JP 10914479 A JP10914479 A JP 10914479A JP S5633860 A JPS5633860 A JP S5633860A
Authority
JP
Japan
Prior art keywords
magnetized
shaving
case
glass tube
magnetic substance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10914479A
Other languages
Japanese (ja)
Inventor
Hajime Terakado
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10914479A priority Critical patent/JPS5633860A/en
Publication of JPS5633860A publication Critical patent/JPS5633860A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the intermittent defective short circuit caused by shavings wafting in a case by a method wherein a magnetized magnetic substance is placed in the vicinity of a semiconductor pellet sealed in the case. CONSTITUTION:Jigs, tools or the like to be used in a sealing process are made by magnetic material such as iron, stainless steel, etc. and at least the thickened sections 2 of slug leads 1 are magnetized. And in the case where very small shaving 6 entered in a glass tube 4, the shaving is attracted and fixed on the end surface of the magnetized slug lead 1, as the shaving is magnetic substance, and they do not waft in the glass tube 4.
JP10914479A 1979-08-29 1979-08-29 Semiconductor device Pending JPS5633860A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10914479A JPS5633860A (en) 1979-08-29 1979-08-29 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10914479A JPS5633860A (en) 1979-08-29 1979-08-29 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5633860A true JPS5633860A (en) 1981-04-04

Family

ID=14502712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10914479A Pending JPS5633860A (en) 1979-08-29 1979-08-29 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5633860A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333830A (en) * 1986-07-28 1988-02-13 Hitachi Ltd Manufacture of semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6333830A (en) * 1986-07-28 1988-02-13 Hitachi Ltd Manufacture of semiconductor device

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