JPS5631896B2 - - Google Patents

Info

Publication number
JPS5631896B2
JPS5631896B2 JP5223779A JP5223779A JPS5631896B2 JP S5631896 B2 JPS5631896 B2 JP S5631896B2 JP 5223779 A JP5223779 A JP 5223779A JP 5223779 A JP5223779 A JP 5223779A JP S5631896 B2 JPS5631896 B2 JP S5631896B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP5223779A
Other languages
Japanese (ja)
Other versions
JPS5522889A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5223779A priority Critical patent/JPS5522889A/ja
Publication of JPS5522889A publication Critical patent/JPS5522889A/ja
Publication of JPS5631896B2 publication Critical patent/JPS5631896B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H10W70/424—Cross-sectional shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07541—Controlling the environment, e.g. atmosphere composition or temperature
    • H10W72/07551—Controlling the environment, e.g. atmosphere composition or temperature characterised by changes in properties of the bond wires during the connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP5223779A 1979-04-27 1979-04-27 Manufacturing method of semiconductor device Granted JPS5522889A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5223779A JPS5522889A (en) 1979-04-27 1979-04-27 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5223779A JPS5522889A (en) 1979-04-27 1979-04-27 Manufacturing method of semiconductor device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP11670274A Division JPS5329549B2 (fa) 1974-10-09 1974-10-09

Publications (2)

Publication Number Publication Date
JPS5522889A JPS5522889A (en) 1980-02-18
JPS5631896B2 true JPS5631896B2 (fa) 1981-07-24

Family

ID=12909106

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5223779A Granted JPS5522889A (en) 1979-04-27 1979-04-27 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5522889A (fa)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199096U (fa) * 1981-06-10 1982-12-17
JPS6083096U (ja) * 1983-11-10 1985-06-08 株式会社サンエツ 浮遊物の除去装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1214254B (it) * 1987-09-23 1990-01-10 Sgs Microelettonica S P A Dispositivo a semiconduttore in contenitore plastico o ceramico con "chips" fissati su entrambi i lati dell'isola centrale del "frame".

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5318872B2 (fa) * 1971-08-04 1978-06-17
JPS499912A (fa) * 1972-05-13 1974-01-29
JPS516055B2 (fa) * 1972-06-26 1976-02-25

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57199096U (fa) * 1981-06-10 1982-12-17
JPS6083096U (ja) * 1983-11-10 1985-06-08 株式会社サンエツ 浮遊物の除去装置

Also Published As

Publication number Publication date
JPS5522889A (en) 1980-02-18

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