JPS5631871Y2 - - Google Patents
Info
- Publication number
- JPS5631871Y2 JPS5631871Y2 JP1977130893U JP13089377U JPS5631871Y2 JP S5631871 Y2 JPS5631871 Y2 JP S5631871Y2 JP 1977130893 U JP1977130893 U JP 1977130893U JP 13089377 U JP13089377 U JP 13089377U JP S5631871 Y2 JPS5631871 Y2 JP S5631871Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977130893U JPS5631871Y2 (cg-RX-API-DMAC7.html) | 1977-09-28 | 1977-09-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1977130893U JPS5631871Y2 (cg-RX-API-DMAC7.html) | 1977-09-28 | 1977-09-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5456566U JPS5456566U (cg-RX-API-DMAC7.html) | 1979-04-19 |
| JPS5631871Y2 true JPS5631871Y2 (cg-RX-API-DMAC7.html) | 1981-07-29 |
Family
ID=29096948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1977130893U Expired JPS5631871Y2 (cg-RX-API-DMAC7.html) | 1977-09-28 | 1977-09-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5631871Y2 (cg-RX-API-DMAC7.html) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2532409B2 (ja) * | 1986-10-30 | 1996-09-11 | 松下電器産業株式会社 | チップボンディング装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS531106B2 (cg-RX-API-DMAC7.html) * | 1973-05-07 | 1978-01-14 |
-
1977
- 1977-09-28 JP JP1977130893U patent/JPS5631871Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5456566U (cg-RX-API-DMAC7.html) | 1979-04-19 |