JPS5629648A - High hardness sintered body - Google Patents

High hardness sintered body

Info

Publication number
JPS5629648A
JPS5629648A JP10442779A JP10442779A JPS5629648A JP S5629648 A JPS5629648 A JP S5629648A JP 10442779 A JP10442779 A JP 10442779A JP 10442779 A JP10442779 A JP 10442779A JP S5629648 A JPS5629648 A JP S5629648A
Authority
JP
Japan
Prior art keywords
binder
cbn
sintered body
temperature
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10442779A
Other languages
Japanese (ja)
Other versions
JPS6133894B2 (en
Inventor
Hiroshi Shimoda
Kouzui Ootani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tungaloy Corp
Original Assignee
Toshiba Tungaloy Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Tungaloy Co Ltd filed Critical Toshiba Tungaloy Co Ltd
Priority to JP10442779A priority Critical patent/JPS5629648A/en
Publication of JPS5629648A publication Critical patent/JPS5629648A/en
Publication of JPS6133894B2 publication Critical patent/JPS6133894B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To enhance properties such as high-temperature hardness, pressure strength, and toughness in the process of preparing a high-hardness sintered body essentially consisting of CBN or WBN by adding a hydride of a specific metal as a binder for intermetallic compounds.
CONSTITUTION: As a binder for hard particles of CBN or WBN, an intermetallic compound of Ni or Co with W, Mo, Nb, V, Ta, etc., is added to undergo pressurizing and forming, and is sintered at high-temperature and high-pressure. At this time, a single or combined hydrides of metals such as TiHX, ZnHX, and HfHX (1≤X≤2) are added as an auxiliary binder. The intermetallic compound is decomposed into hydrogen and metal in pretreatment at high temperature and high pressure where the generated hydrogen cleans the surface of CBN and binder, the metal acts as a strong auxiliary binder. The obtained high-hardness sintered body 1 is brazed to the notch 3 of a bit holder 2 either directly or via a base 4 of cemented carbide or high-speed steel, etc.
COPYRIGHT: (C)1981,JPO&Japio
JP10442779A 1979-08-16 1979-08-16 High hardness sintered body Granted JPS5629648A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10442779A JPS5629648A (en) 1979-08-16 1979-08-16 High hardness sintered body

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10442779A JPS5629648A (en) 1979-08-16 1979-08-16 High hardness sintered body

Publications (2)

Publication Number Publication Date
JPS5629648A true JPS5629648A (en) 1981-03-25
JPS6133894B2 JPS6133894B2 (en) 1986-08-05

Family

ID=14380380

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10442779A Granted JPS5629648A (en) 1979-08-16 1979-08-16 High hardness sintered body

Country Status (1)

Country Link
JP (1) JPS5629648A (en)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103579184A (en) * 2012-07-26 2014-02-12 朗姆研究公司 Ternary tungsten boride nitride films and methods for forming same
US9583385B2 (en) 2001-05-22 2017-02-28 Novellus Systems, Inc. Method for producing ultra-thin tungsten layers with improved step coverage
US9589808B2 (en) 2013-12-19 2017-03-07 Lam Research Corporation Method for depositing extremely low resistivity tungsten
US9613818B2 (en) 2015-05-27 2017-04-04 Lam Research Corporation Deposition of low fluorine tungsten by sequential CVD process
US9653353B2 (en) 2009-08-04 2017-05-16 Novellus Systems, Inc. Tungsten feature fill
US9673146B2 (en) 2009-04-16 2017-06-06 Novellus Systems, Inc. Low temperature tungsten film deposition for small critical dimension contacts and interconnects
US9754824B2 (en) 2015-05-27 2017-09-05 Lam Research Corporation Tungsten films having low fluorine content
US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US9978605B2 (en) 2015-05-27 2018-05-22 Lam Research Corporation Method of forming low resistivity fluorine free tungsten film without nucleation
US10256142B2 (en) 2009-08-04 2019-04-09 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
US10510590B2 (en) 2017-04-10 2019-12-17 Lam Research Corporation Low resistivity films containing molybdenum
US11348795B2 (en) 2017-08-14 2022-05-31 Lam Research Corporation Metal fill process for three-dimensional vertical NAND wordline
US11549175B2 (en) 2018-05-03 2023-01-10 Lam Research Corporation Method of depositing tungsten and other metals in 3D NAND structures
US11972952B2 (en) 2018-12-14 2024-04-30 Lam Research Corporation Atomic layer deposition on 3D NAND structures
US12002679B2 (en) 2019-04-11 2024-06-04 Lam Research Corporation High step coverage tungsten deposition

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6090178A (en) * 1998-04-22 2000-07-18 Sinterfire, Inc. Frangible metal bullets, ammunition and method of making such articles

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9583385B2 (en) 2001-05-22 2017-02-28 Novellus Systems, Inc. Method for producing ultra-thin tungsten layers with improved step coverage
US9673146B2 (en) 2009-04-16 2017-06-06 Novellus Systems, Inc. Low temperature tungsten film deposition for small critical dimension contacts and interconnects
US10103058B2 (en) 2009-08-04 2018-10-16 Novellus Systems, Inc. Tungsten feature fill
US9653353B2 (en) 2009-08-04 2017-05-16 Novellus Systems, Inc. Tungsten feature fill
US10256142B2 (en) 2009-08-04 2019-04-09 Novellus Systems, Inc. Tungsten feature fill with nucleation inhibition
CN103579184B (en) * 2012-07-26 2017-04-12 朗姆研究公司 Ternary tungsten boride nitride films and methods for forming same
US9969622B2 (en) 2012-07-26 2018-05-15 Lam Research Corporation Ternary tungsten boride nitride films and methods for forming same
CN103579184A (en) * 2012-07-26 2014-02-12 朗姆研究公司 Ternary tungsten boride nitride films and methods for forming same
US9589808B2 (en) 2013-12-19 2017-03-07 Lam Research Corporation Method for depositing extremely low resistivity tungsten
US10529722B2 (en) 2015-02-11 2020-01-07 Lam Research Corporation Tungsten for wordline applications
US9953984B2 (en) 2015-02-11 2018-04-24 Lam Research Corporation Tungsten for wordline applications
US9978605B2 (en) 2015-05-27 2018-05-22 Lam Research Corporation Method of forming low resistivity fluorine free tungsten film without nucleation
US9754824B2 (en) 2015-05-27 2017-09-05 Lam Research Corporation Tungsten films having low fluorine content
US9613818B2 (en) 2015-05-27 2017-04-04 Lam Research Corporation Deposition of low fluorine tungsten by sequential CVD process
US10546751B2 (en) 2015-05-27 2020-01-28 Lam Research Corporation Forming low resistivity fluorine free tungsten film without nucleation
US10510590B2 (en) 2017-04-10 2019-12-17 Lam Research Corporation Low resistivity films containing molybdenum
US11348795B2 (en) 2017-08-14 2022-05-31 Lam Research Corporation Metal fill process for three-dimensional vertical NAND wordline
US11549175B2 (en) 2018-05-03 2023-01-10 Lam Research Corporation Method of depositing tungsten and other metals in 3D NAND structures
US11972952B2 (en) 2018-12-14 2024-04-30 Lam Research Corporation Atomic layer deposition on 3D NAND structures
US12002679B2 (en) 2019-04-11 2024-06-04 Lam Research Corporation High step coverage tungsten deposition

Also Published As

Publication number Publication date
JPS6133894B2 (en) 1986-08-05

Similar Documents

Publication Publication Date Title
JPS5629648A (en) High hardness sintered body
US4447263A (en) Blade member of cermet having surface reaction layer and process for producing same
EP0337696B1 (en) A surface-coated cemented carbide
US4022584A (en) Sintered cermets for tool and wear applications
US3647576A (en) Method of hardening sintered cemented carbide compositions by boronizing
GB1573891A (en) Method of producing hard metal bodies of wear resistance
GB1595517A (en) Production of hard bodies from metal powders
KR100851021B1 (en) Chromium-containing cemented tungsten carbide body
CN107058901A (en) A kind of preparation method of high-toughness heat-resistant TiC/TiN steel bonded carbide
JP2628200B2 (en) TiCN-based cermet and method for producing the same
GB2392675A (en) Multi-Element Ceramic Powder And Method For Preparation Thereof, And Sintered Compact and Method For Preparation Thereof
JPS5597448A (en) Sintered body containing high density phase boron nitride and preparation of the same
GB1558626A (en) Cutting process
JPS5629650A (en) High hardness sintered body
JPS5629649A (en) High hardness sintered body
JPS5518508A (en) Sintering material having toughness and abrasion resisting property
JPS5531517A (en) Sintered material with tenacity and wear resistance for cutting tool
JPS5474210A (en) Composite sintered tools
CN106591674A (en) Preparation method for high-strength high-toughness heat-resistant TiN steel-bonded hard alloy
JPH09136203A (en) High strength cubic crystal boron nitride base sintered body
JPH07150286A (en) Ticn-based cermet
US5036028A (en) High density metal boride-based ceramic sintered body
GB1321947A (en) Process for producing a cemented tungsten carbide composition
SE7408051L (en)
JPS5669350A (en) High hardness sintered body for cutting