JPS5629356A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5629356A
JPS5629356A JP10536579A JP10536579A JPS5629356A JP S5629356 A JPS5629356 A JP S5629356A JP 10536579 A JP10536579 A JP 10536579A JP 10536579 A JP10536579 A JP 10536579A JP S5629356 A JPS5629356 A JP S5629356A
Authority
JP
Japan
Prior art keywords
lead wire
press
cathode
spring
gate electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10536579A
Other languages
Japanese (ja)
Other versions
JPS5933260B2 (en
Inventor
Futoshi Tokuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10536579A priority Critical patent/JPS5933260B2/en
Publication of JPS5629356A publication Critical patent/JPS5629356A/en
Publication of JPS5933260B2 publication Critical patent/JPS5933260B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To precisely position the end of a lead wire with respect to a gate electrode and improve the reliability of the semiconductor device by supporting the lead wire by a member supported to the cathode of a semiconductor element. CONSTITUTION:A spring 12 is inserted into a positioning member 15, a lead wire 9 coated with an insulating tube 10 is passed through the side wall hole, and the end is supported by a support 11, and is elastically pressed by the spring 12. A member 15 is engaged with the cutout 3-1b of a cathode of a semiconductor element by press-fitting a connector 15a thereinto in rotation. The member 15 is inserted on the outer periphery into the inner periphery of the collar 3-1a, and the lead wire 9 is press-contacted at the end simultaneously with the gate electrode 3-2 by the spring 12. Then, the element 3 is contained in an insulating cylinder 4, the member 15 is inserted at the end into the hole 1a of an external cathode, the lead wire 9 is press- fitted into other hole 1b to be inserted into the external gate electrode 8, an external anode 2 is coated thereon, and the outer peripheries of the lead wires 6, 7 are welded to the electrode 8 and the lead wire 9. This configuration can precisely retain the position of the end of the gate lead wire to improve the reliability of the semiconductor device.
JP10536579A 1979-08-18 1979-08-18 semiconductor equipment Expired JPS5933260B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10536579A JPS5933260B2 (en) 1979-08-18 1979-08-18 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10536579A JPS5933260B2 (en) 1979-08-18 1979-08-18 semiconductor equipment

Publications (2)

Publication Number Publication Date
JPS5629356A true JPS5629356A (en) 1981-03-24
JPS5933260B2 JPS5933260B2 (en) 1984-08-14

Family

ID=14405686

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10536579A Expired JPS5933260B2 (en) 1979-08-18 1979-08-18 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS5933260B2 (en)

Also Published As

Publication number Publication date
JPS5933260B2 (en) 1984-08-14

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