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Filing date
Publication date
Application filedfiledCritical
Priority to JP15290176ApriorityCriticalpatent/JPS5378063A/ja
Publication of JPS5378063ApublicationCriticalpatent/JPS5378063A/ja
Publication of JPS5628380B2publicationCriticalpatent/JPS5628380B2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
Electric Connection Of Electric Components To Printed Circuits
(AREA)
Wire Bonding
(AREA)
JP15290176A1976-12-211976-12-21Method of producing hyb ic
GrantedJPS5378063A
(en)