JPS5378063A - Method of producing hyb ic - Google Patents

Method of producing hyb ic

Info

Publication number
JPS5378063A
JPS5378063A JP15290176A JP15290176A JPS5378063A JP S5378063 A JPS5378063 A JP S5378063A JP 15290176 A JP15290176 A JP 15290176A JP 15290176 A JP15290176 A JP 15290176A JP S5378063 A JPS5378063 A JP S5378063A
Authority
JP
Japan
Prior art keywords
hyb
producing
producing hyb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15290176A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5628380B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Niikura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15290176A priority Critical patent/JPS5378063A/ja
Publication of JPS5378063A publication Critical patent/JPS5378063A/ja
Publication of JPS5628380B2 publication Critical patent/JPS5628380B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP15290176A 1976-12-21 1976-12-21 Method of producing hyb ic Granted JPS5378063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15290176A JPS5378063A (en) 1976-12-21 1976-12-21 Method of producing hyb ic

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15290176A JPS5378063A (en) 1976-12-21 1976-12-21 Method of producing hyb ic

Publications (2)

Publication Number Publication Date
JPS5378063A true JPS5378063A (en) 1978-07-11
JPS5628380B2 JPS5628380B2 (enrdf_load_stackoverflow) 1981-07-01

Family

ID=15550600

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15290176A Granted JPS5378063A (en) 1976-12-21 1976-12-21 Method of producing hyb ic

Country Status (1)

Country Link
JP (1) JPS5378063A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS5628380B2 (enrdf_load_stackoverflow) 1981-07-01

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