JPS562674A - Assembling method of solid state image sensing device - Google Patents

Assembling method of solid state image sensing device

Info

Publication number
JPS562674A
JPS562674A JP7807779A JP7807779A JPS562674A JP S562674 A JPS562674 A JP S562674A JP 7807779 A JP7807779 A JP 7807779A JP 7807779 A JP7807779 A JP 7807779A JP S562674 A JPS562674 A JP S562674A
Authority
JP
Japan
Prior art keywords
marking
adhesive
optical filter
ccd chip
image sensing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7807779A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6161262B2 (fa
Inventor
Okio Yoshida
Hiroo Takemura
Takeshi Miura
Tetsuo Ogawara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Tokyo Optical Co Ltd
Original Assignee
Toshiba Corp
Tokyo Optical Co Ltd
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Optical Co Ltd, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP7807779A priority Critical patent/JPS562674A/ja
Publication of JPS562674A publication Critical patent/JPS562674A/ja
Publication of JPS6161262B2 publication Critical patent/JPS6161262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/682—Shapes or dispositions thereof comprising holes having chips therein
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Color Television Image Signal Generators (AREA)
  • Optical Filters (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP7807779A 1979-06-22 1979-06-22 Assembling method of solid state image sensing device Granted JPS562674A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7807779A JPS562674A (en) 1979-06-22 1979-06-22 Assembling method of solid state image sensing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7807779A JPS562674A (en) 1979-06-22 1979-06-22 Assembling method of solid state image sensing device

Publications (2)

Publication Number Publication Date
JPS562674A true JPS562674A (en) 1981-01-12
JPS6161262B2 JPS6161262B2 (fa) 1986-12-24

Family

ID=13651770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7807779A Granted JPS562674A (en) 1979-06-22 1979-06-22 Assembling method of solid state image sensing device

Country Status (1)

Country Link
JP (1) JPS562674A (fa)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56131974A (en) * 1980-03-19 1981-10-15 Matsushita Electric Ind Co Ltd Manufacture of solid image photographing element
JPS60185350U (ja) * 1984-05-17 1985-12-09 ソニー株式会社 色フイルタ−貼り合せ装置
JPH02105458A (ja) * 1988-10-13 1990-04-18 Nec Corp 固体撮像装置とその製造方法
DE3923023A1 (de) * 1989-07-12 1991-01-24 Siemens Ag Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63155758U (fa) * 1987-03-30 1988-10-13

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319351A (en) * 1976-08-09 1978-02-22 Kansai Paint Co Ltd Photosensitive adhesive composition
JPS5384413A (en) * 1976-12-29 1978-07-25 Matsushita Electric Ind Co Ltd Solid state pickup device
JPS5390872A (en) * 1977-01-21 1978-08-10 Canon Inc Optical device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5319351A (en) * 1976-08-09 1978-02-22 Kansai Paint Co Ltd Photosensitive adhesive composition
JPS5384413A (en) * 1976-12-29 1978-07-25 Matsushita Electric Ind Co Ltd Solid state pickup device
JPS5390872A (en) * 1977-01-21 1978-08-10 Canon Inc Optical device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56131974A (en) * 1980-03-19 1981-10-15 Matsushita Electric Ind Co Ltd Manufacture of solid image photographing element
JPS60185350U (ja) * 1984-05-17 1985-12-09 ソニー株式会社 色フイルタ−貼り合せ装置
JPH02105458A (ja) * 1988-10-13 1990-04-18 Nec Corp 固体撮像装置とその製造方法
DE3923023A1 (de) * 1989-07-12 1991-01-24 Siemens Ag Uv-haertbarer klebstoff fuer ein halbleiterchipmontageverfahren

Also Published As

Publication number Publication date
JPS6161262B2 (fa) 1986-12-24

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