JPS5625785B2 - - Google Patents

Info

Publication number
JPS5625785B2
JPS5625785B2 JP14585877A JP14585877A JPS5625785B2 JP S5625785 B2 JPS5625785 B2 JP S5625785B2 JP 14585877 A JP14585877 A JP 14585877A JP 14585877 A JP14585877 A JP 14585877A JP S5625785 B2 JPS5625785 B2 JP S5625785B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14585877A
Other languages
Japanese (ja)
Other versions
JPS5478670A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14585877A priority Critical patent/JPS5478670A/ja
Publication of JPS5478670A publication Critical patent/JPS5478670A/ja
Publication of JPS5625785B2 publication Critical patent/JPS5625785B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP14585877A 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device Granted JPS5478670A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14585877A JPS5478670A (en) 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14585877A JPS5478670A (en) 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device

Publications (2)

Publication Number Publication Date
JPS5478670A JPS5478670A (en) 1979-06-22
JPS5625785B2 true JPS5625785B2 (cs) 1981-06-15

Family

ID=15394697

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14585877A Granted JPS5478670A (en) 1977-12-05 1977-12-05 High-density packing integrated circuit substrate device

Country Status (1)

Country Link
JP (1) JPS5478670A (cs)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5283715A (en) * 1992-09-29 1994-02-01 International Business Machines, Inc. Integrated heat pipe and circuit board structure
WO2015097833A1 (ja) * 2013-12-26 2015-07-02 三菱電機株式会社 電力変換装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5050411A (cs) * 1973-09-05 1975-05-06
JPS50139969A (cs) * 1974-04-30 1975-11-10
JPS523361B2 (cs) * 1972-03-14 1977-01-27

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5529243Y2 (cs) * 1975-06-24 1980-07-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS523361B2 (cs) * 1972-03-14 1977-01-27
JPS5050411A (cs) * 1973-09-05 1975-05-06
JPS50139969A (cs) * 1974-04-30 1975-11-10

Also Published As

Publication number Publication date
JPS5478670A (en) 1979-06-22

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