JPS5625247Y2 - - Google Patents

Info

Publication number
JPS5625247Y2
JPS5625247Y2 JP1975038285U JP3828575U JPS5625247Y2 JP S5625247 Y2 JPS5625247 Y2 JP S5625247Y2 JP 1975038285 U JP1975038285 U JP 1975038285U JP 3828575 U JP3828575 U JP 3828575U JP S5625247 Y2 JPS5625247 Y2 JP S5625247Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1975038285U
Other languages
Japanese (ja)
Other versions
JPS51121171U (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1975038285U priority Critical patent/JPS5625247Y2/ja
Publication of JPS51121171U publication Critical patent/JPS51121171U/ja
Application granted granted Critical
Publication of JPS5625247Y2 publication Critical patent/JPS5625247Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
JP1975038285U 1975-03-20 1975-03-20 Expired JPS5625247Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1975038285U JPS5625247Y2 (enrdf_load_stackoverflow) 1975-03-20 1975-03-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1975038285U JPS5625247Y2 (enrdf_load_stackoverflow) 1975-03-20 1975-03-20

Publications (2)

Publication Number Publication Date
JPS51121171U JPS51121171U (enrdf_load_stackoverflow) 1976-10-01
JPS5625247Y2 true JPS5625247Y2 (enrdf_load_stackoverflow) 1981-06-15

Family

ID=28159990

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1975038285U Expired JPS5625247Y2 (enrdf_load_stackoverflow) 1975-03-20 1975-03-20

Country Status (1)

Country Link
JP (1) JPS5625247Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5812452Y2 (ja) * 1977-02-07 1983-03-09 日本電気ホームエレクトロニクス株式会社 半導体装置
JPS5812453Y2 (ja) * 1977-02-23 1983-03-09 日本電気ホームエレクトロニクス株式会社 半導体装置のリ−ドフレ−ム構体

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5143723Y2 (enrdf_load_stackoverflow) * 1972-01-20 1976-10-23

Also Published As

Publication number Publication date
JPS51121171U (enrdf_load_stackoverflow) 1976-10-01

Similar Documents

Publication Publication Date Title
BE849955A (enrdf_load_stackoverflow)
BG21641A1 (enrdf_load_stackoverflow)
BG22296A1 (enrdf_load_stackoverflow)
BG22453A1 (enrdf_load_stackoverflow)
BG22641A1 (enrdf_load_stackoverflow)
BG22721A1 (enrdf_load_stackoverflow)
BG23048A1 (enrdf_load_stackoverflow)
BG23128A1 (enrdf_load_stackoverflow)
CH576069A5 (enrdf_load_stackoverflow)
CH577556A5 (enrdf_load_stackoverflow)
CH579998A5 (enrdf_load_stackoverflow)
CH585501A5 (enrdf_load_stackoverflow)
CH586328A5 (enrdf_load_stackoverflow)
CH587781A5 (enrdf_load_stackoverflow)
CH588917A5 (enrdf_load_stackoverflow)
CH589120A5 (enrdf_load_stackoverflow)
CH589348A5 (enrdf_load_stackoverflow)
CH589351A5 (enrdf_load_stackoverflow)
CH589395A5 (enrdf_load_stackoverflow)
CH589559A5 (enrdf_load_stackoverflow)
CH589948A5 (enrdf_load_stackoverflow)
CH590994A5 (enrdf_load_stackoverflow)
CH591742A5 (enrdf_load_stackoverflow)
CH592401A5 (enrdf_load_stackoverflow)
CH592426A5 (enrdf_load_stackoverflow)