JPS5625247Y2 - - Google Patents
Info
- Publication number
- JPS5625247Y2 JPS5625247Y2 JP1975038285U JP3828575U JPS5625247Y2 JP S5625247 Y2 JPS5625247 Y2 JP S5625247Y2 JP 1975038285 U JP1975038285 U JP 1975038285U JP 3828575 U JP3828575 U JP 3828575U JP S5625247 Y2 JPS5625247 Y2 JP S5625247Y2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/541—Dispositions of bond wires
- H10W72/5449—Dispositions of bond wires not being orthogonal to a side surface of the chip, e.g. fan-out arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975038285U JPS5625247Y2 (cg-RX-API-DMAC7.html) | 1975-03-20 | 1975-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1975038285U JPS5625247Y2 (cg-RX-API-DMAC7.html) | 1975-03-20 | 1975-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS51121171U JPS51121171U (cg-RX-API-DMAC7.html) | 1976-10-01 |
| JPS5625247Y2 true JPS5625247Y2 (cg-RX-API-DMAC7.html) | 1981-06-15 |
Family
ID=28159990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1975038285U Expired JPS5625247Y2 (cg-RX-API-DMAC7.html) | 1975-03-20 | 1975-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5625247Y2 (cg-RX-API-DMAC7.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5812452Y2 (ja) * | 1977-02-07 | 1983-03-09 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
| JPS5812453Y2 (ja) * | 1977-02-23 | 1983-03-09 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置のリ−ドフレ−ム構体 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5143723Y2 (cg-RX-API-DMAC7.html) * | 1972-01-20 | 1976-10-23 |
-
1975
- 1975-03-20 JP JP1975038285U patent/JPS5625247Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS51121171U (cg-RX-API-DMAC7.html) | 1976-10-01 |