JPS5623892Y2 - - Google Patents

Info

Publication number
JPS5623892Y2
JPS5623892Y2 JP1974107282U JP10728274U JPS5623892Y2 JP S5623892 Y2 JPS5623892 Y2 JP S5623892Y2 JP 1974107282 U JP1974107282 U JP 1974107282U JP 10728274 U JP10728274 U JP 10728274U JP S5623892 Y2 JPS5623892 Y2 JP S5623892Y2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1974107282U
Other languages
Japanese (ja)
Other versions
JPS5134371U (zh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1974107282U priority Critical patent/JPS5623892Y2/ja
Priority to DE19752539604 priority patent/DE2539604A1/de
Publication of JPS5134371U publication Critical patent/JPS5134371U/ja
Application granted granted Critical
Publication of JPS5623892Y2 publication Critical patent/JPS5623892Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings
    • G04G17/02—Component assemblies
    • G04G17/04—Mounting of electronic components
    • G—PHYSICS
    • G04—HOROLOGY
    • G04C—ELECTROMECHANICAL CLOCKS OR WATCHES
    • G04C10/00—Arrangements of electric power supplies in time pieces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05553—Shape in top view being rectangular
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Electric Clocks (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Electromechanical Clocks (AREA)
JP1974107282U 1974-09-06 1974-09-06 Expired JPS5623892Y2 (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1974107282U JPS5623892Y2 (zh) 1974-09-06 1974-09-06
DE19752539604 DE2539604A1 (de) 1974-09-06 1975-09-05 Integrierte schaltungseinheit fuer eine elektrische uhr

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1974107282U JPS5623892Y2 (zh) 1974-09-06 1974-09-06

Publications (2)

Publication Number Publication Date
JPS5134371U JPS5134371U (zh) 1976-03-13
JPS5623892Y2 true JPS5623892Y2 (zh) 1981-06-04

Family

ID=14455112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1974107282U Expired JPS5623892Y2 (zh) 1974-09-06 1974-09-06

Country Status (2)

Country Link
JP (1) JPS5623892Y2 (zh)
DE (1) DE2539604A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3427908C2 (de) * 1984-07-28 1986-10-02 Gebrüder Junghans GmbH, 7230 Schramberg Verfahren zum Herstellen des Schaltungsträgers eines elektromechanischen Uhrwerks und nach solchem Verfahren herstellbarer Schaltungsträger
US4796239A (en) * 1986-05-08 1989-01-03 Seikosha Co., Ltd. Circuit unit for timepiece and process for fabricating the same
CH680252B5 (zh) * 1990-08-21 1993-01-29 Ebauchesfabrik Eta Ag

Also Published As

Publication number Publication date
DE2539604A1 (de) 1976-03-25
JPS5134371U (zh) 1976-03-13

Similar Documents

Publication Publication Date Title
FR2278049B1 (zh)
AU495920B2 (zh)
AU7138274A (zh)
AU7099174A (zh)
BG20443A1 (zh)
CH1107074A4 (zh)
AU481101A (zh)
AU481340A (zh)
AU479725A (zh)
AU481580A (zh)
AU482019A (zh)
AU482110A (zh)
AU482332A (zh)
AU481044A (zh)
AU480580A (zh)
AU480469A (zh)
BG19607A1 (zh)
BG19772A1 (zh)
BG19828A1 (zh)
BG19873A1 (zh)
BG20667A1 (zh)
BG19982A1 (zh)
BG20001A1 (zh)
BG20159A1 (zh)
BG22309A1 (zh)