JPS5620113B1 - - Google Patents
Info
- Publication number
- JPS5620113B1 JPS5620113B1 JP713049A JP304971A JPS5620113B1 JP S5620113 B1 JPS5620113 B1 JP S5620113B1 JP 713049 A JP713049 A JP 713049A JP 304971 A JP304971 A JP 304971A JP S5620113 B1 JPS5620113 B1 JP S5620113B1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
- B23K20/08—Explosive welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
- B23K20/08—Explosive welding
- B23K20/085—Explosive welding for tubes, e.g. plugging
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US682970A | 1970-01-29 | 1970-01-29 | |
US6843170A | 1970-08-31 | 1970-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5620113B1 true JPS5620113B1 (xx) | 1981-05-12 |
Family
ID=26676117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP713049A Pending JPS5620113B1 (xx) | 1970-01-29 | 1971-01-29 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS5620113B1 (xx) |
CA (1) | CA927980A (xx) |
ES (1) | ES388081A1 (xx) |
IE (1) | IE34898B1 (xx) |
SE (1) | SE370308B (xx) |
-
1970
- 1970-11-24 CA CA098976A patent/CA927980A/en not_active Expired
-
1971
- 1971-01-19 IE IE62/71A patent/IE34898B1/xx unknown
- 1971-01-21 SE SE7100703A patent/SE370308B/xx unknown
- 1971-01-27 ES ES388081A patent/ES388081A1/es not_active Expired
- 1971-01-29 JP JP713049A patent/JPS5620113B1/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
ES388081A1 (es) | 1974-11-16 |
SE370308B (xx) | 1974-10-07 |
CA927980A (en) | 1973-06-05 |
IE34898B1 (en) | 1975-09-17 |
IE34898L (en) | 1971-07-29 |