CA927980A - Explosive bonding of workpieces - Google Patents

Explosive bonding of workpieces

Info

Publication number
CA927980A
CA927980A CA098976A CA98976A CA927980A CA 927980 A CA927980 A CA 927980A CA 098976 A CA098976 A CA 098976A CA 98976 A CA98976 A CA 98976A CA 927980 A CA927980 A CA 927980A
Authority
CA
Canada
Prior art keywords
workpieces
explosive bonding
explosive
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
CA098976A
Other versions
CA98976S (en
Inventor
H. Cranston Benjamin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AT&T Corp
Original Assignee
Western Electric Co Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co Inc filed Critical Western Electric Co Inc
Priority to CA137645A priority Critical patent/CA931645A/en
Priority to CA137646A priority patent/CA930871A/en
Priority to CA137643A priority patent/CA927019A/en
Priority to CA137642A priority patent/CA927018A/en
Application granted granted Critical
Publication of CA927980A publication Critical patent/CA927980A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
    • B23K20/08—Explosive welding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/06—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of high energy impulses, e.g. magnetic energy
    • B23K20/08—Explosive welding
    • B23K20/085—Explosive welding for tubes, e.g. plugging
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N97/00—Electric solid-state thin-film or thick-film devices, not otherwise provided for
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
CA098976A 1970-01-29 1970-11-24 Explosive bonding of workpieces Expired CA927980A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CA137645A CA931645A (en) 1970-01-29 1972-03-21 Capacitor and method of manufacturing thereof
CA137646A CA930871A (en) 1970-01-29 1972-03-21 Resistor and method of manufacturing thereof
CA137643A CA927019A (en) 1970-01-29 1972-03-21 Explosive metal-working process and beam lead-like device
CA137642A CA927018A (en) 1970-01-29 1972-03-21 Buffer medium for use in an explosive metal-working process

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US682970A 1970-01-29 1970-01-29
US6843170A 1970-08-31 1970-08-31

Publications (1)

Publication Number Publication Date
CA927980A true CA927980A (en) 1973-06-05

Family

ID=26676117

Family Applications (1)

Application Number Title Priority Date Filing Date
CA098976A Expired CA927980A (en) 1970-01-29 1970-11-24 Explosive bonding of workpieces

Country Status (5)

Country Link
JP (1) JPS5620113B1 (en)
CA (1) CA927980A (en)
ES (1) ES388081A1 (en)
IE (1) IE34898B1 (en)
SE (1) SE370308B (en)

Also Published As

Publication number Publication date
ES388081A1 (en) 1974-11-16
IE34898B1 (en) 1975-09-17
IE34898L (en) 1971-07-29
SE370308B (en) 1974-10-07
JPS5620113B1 (en) 1981-05-12

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