JPS56174872U - - Google Patents
Info
- Publication number
- JPS56174872U JPS56174872U JP7290880U JP7290880U JPS56174872U JP S56174872 U JPS56174872 U JP S56174872U JP 7290880 U JP7290880 U JP 7290880U JP 7290880 U JP7290880 U JP 7290880U JP S56174872 U JPS56174872 U JP S56174872U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7290880U JPS6125270Y2 (fr) | 1980-05-26 | 1980-05-26 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7290880U JPS6125270Y2 (fr) | 1980-05-26 | 1980-05-26 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56174872U true JPS56174872U (fr) | 1981-12-23 |
JPS6125270Y2 JPS6125270Y2 (fr) | 1986-07-29 |
Family
ID=29435928
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7290880U Expired JPS6125270Y2 (fr) | 1980-05-26 | 1980-05-26 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6125270Y2 (fr) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241509A (ja) * | 2003-02-04 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Led光源、led照明装置、およびled表示装置 |
JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005116846A (ja) * | 2003-10-09 | 2005-04-28 | Hitachi Cable Ltd | 発光装置及び発光装置に用いる配線板、ならびに配線板の製造方法 |
JP2006517738A (ja) * | 2003-02-07 | 2006-07-27 | 松下電器産業株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
JP2007123939A (ja) * | 2007-01-29 | 2007-05-17 | Kyocera Corp | 発光装置 |
JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
JP2007142477A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
JP2008108861A (ja) * | 2006-10-25 | 2008-05-08 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 光源にフレキシブルpcbが直結された発光ダイオードパッケージ |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20090032829A1 (en) * | 2007-07-30 | 2009-02-05 | Tong Fatt Chew | LED Light Source with Increased Thermal Conductivity |
-
1980
- 1980-05-26 JP JP7290880U patent/JPS6125270Y2/ja not_active Expired
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004241509A (ja) * | 2003-02-04 | 2004-08-26 | Matsushita Electric Ind Co Ltd | Led光源、led照明装置、およびled表示装置 |
JP2006517738A (ja) * | 2003-02-07 | 2006-07-27 | 松下電器産業株式会社 | 発光体用金属ベース基板、発光光源、照明装置及び表示装置 |
JP2004259958A (ja) * | 2003-02-26 | 2004-09-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
JP2005116846A (ja) * | 2003-10-09 | 2005-04-28 | Hitachi Cable Ltd | 発光装置及び発光装置に用いる配線板、ならびに配線板の製造方法 |
JP2008108861A (ja) * | 2006-10-25 | 2008-05-08 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 光源にフレキシブルpcbが直結された発光ダイオードパッケージ |
JP2007123939A (ja) * | 2007-01-29 | 2007-05-17 | Kyocera Corp | 発光装置 |
JP2007142476A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
JP2007142477A (ja) * | 2007-02-27 | 2007-06-07 | Kyocera Corp | 発光装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6125270Y2 (fr) | 1986-07-29 |