JPS56174872U - - Google Patents

Info

Publication number
JPS56174872U
JPS56174872U JP7290880U JP7290880U JPS56174872U JP S56174872 U JPS56174872 U JP S56174872U JP 7290880 U JP7290880 U JP 7290880U JP 7290880 U JP7290880 U JP 7290880U JP S56174872 U JPS56174872 U JP S56174872U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7290880U
Other languages
Japanese (ja)
Other versions
JPS6125270Y2 (enrdf_load_stackoverflow
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7290880U priority Critical patent/JPS6125270Y2/ja
Publication of JPS56174872U publication Critical patent/JPS56174872U/ja
Application granted granted Critical
Publication of JPS6125270Y2 publication Critical patent/JPS6125270Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
JP7290880U 1980-05-26 1980-05-26 Expired JPS6125270Y2 (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7290880U JPS6125270Y2 (enrdf_load_stackoverflow) 1980-05-26 1980-05-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7290880U JPS6125270Y2 (enrdf_load_stackoverflow) 1980-05-26 1980-05-26

Publications (2)

Publication Number Publication Date
JPS56174872U true JPS56174872U (enrdf_load_stackoverflow) 1981-12-23
JPS6125270Y2 JPS6125270Y2 (enrdf_load_stackoverflow) 1986-07-29

Family

ID=29435928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7290880U Expired JPS6125270Y2 (enrdf_load_stackoverflow) 1980-05-26 1980-05-26

Country Status (1)

Country Link
JP (1) JPS6125270Y2 (enrdf_load_stackoverflow)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005116846A (ja) * 2003-10-09 2005-04-28 Hitachi Cable Ltd 発光装置及び発光装置に用いる配線板、ならびに配線板の製造方法
JP2006517738A (ja) * 2003-02-07 2006-07-27 松下電器産業株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2007123939A (ja) * 2007-01-29 2007-05-17 Kyocera Corp 発光装置
JP2007142477A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2007142476A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2008108861A (ja) * 2006-10-25 2008-05-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090032829A1 (en) * 2007-07-30 2009-02-05 Tong Fatt Chew LED Light Source with Increased Thermal Conductivity

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004241509A (ja) * 2003-02-04 2004-08-26 Matsushita Electric Ind Co Ltd Ｌｅｄ光源、ｌｅｄ照明装置、およびｌｅｄ表示装置
JP2006517738A (ja) * 2003-02-07 2006-07-27 松下電器産業株式会社 発光体用金属ベース基板、発光光源、照明装置及び表示装置
JP2004259958A (ja) * 2003-02-26 2004-09-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP2005116846A (ja) * 2003-10-09 2005-04-28 Hitachi Cable Ltd 発光装置及び発光装置に用いる配線板、ならびに配線板の製造方法
JP2008108861A (ja) * 2006-10-25 2008-05-08 Avago Technologies Ecbu Ip (Singapore) Pte Ltd 光源にフレキシブルｐｃｂが直結された発光ダイオードパッケージ
JP2007123939A (ja) * 2007-01-29 2007-05-17 Kyocera Corp 発光装置
JP2007142477A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置
JP2007142476A (ja) * 2007-02-27 2007-06-07 Kyocera Corp 発光装置

Also Published As

Publication number Publication date
JPS6125270Y2 (enrdf_load_stackoverflow) 1986-07-29

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