JPS5617045A - Conductive molding material based on halogen-containing resin composition - Google Patents

Conductive molding material based on halogen-containing resin composition

Info

Publication number
JPS5617045A
JPS5617045A JP9241879A JP9241879A JPS5617045A JP S5617045 A JPS5617045 A JP S5617045A JP 9241879 A JP9241879 A JP 9241879A JP 9241879 A JP9241879 A JP 9241879A JP S5617045 A JPS5617045 A JP S5617045A
Authority
JP
Japan
Prior art keywords
halogen
molding material
containing resin
acid ester
added
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9241879A
Other languages
English (en)
Inventor
Jinsuke Inomata
Yoshitaka Tanaka
Kentaro Yuasa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyodo Chemical Co Ltd
Original Assignee
Kyodo Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyodo Chemical Co Ltd filed Critical Kyodo Chemical Co Ltd
Priority to JP9241879A priority Critical patent/JPS5617045A/ja
Publication of JPS5617045A publication Critical patent/JPS5617045A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4827—Materials
    • H01L23/4828—Conductive organic material or pastes, e.g. conductive adhesives, inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
JP9241879A 1979-07-20 1979-07-20 Conductive molding material based on halogen-containing resin composition Pending JPS5617045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9241879A JPS5617045A (en) 1979-07-20 1979-07-20 Conductive molding material based on halogen-containing resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9241879A JPS5617045A (en) 1979-07-20 1979-07-20 Conductive molding material based on halogen-containing resin composition

Publications (1)

Publication Number Publication Date
JPS5617045A true JPS5617045A (en) 1981-02-18

Family

ID=14053861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9241879A Pending JPS5617045A (en) 1979-07-20 1979-07-20 Conductive molding material based on halogen-containing resin composition

Country Status (1)

Country Link
JP (1) JPS5617045A (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108237A (ja) * 1981-12-19 1983-06-28 Toyo Rubber Chem Ind Co Ltd 無帯電性合成樹脂無発泡成型体の製造方法
JPS62141067A (ja) * 1985-12-16 1987-06-24 Toshiba Chem Corp 導電性樹脂組成物
JPS6361253U (ja) * 1986-10-07 1988-04-23
JPH01500277A (ja) * 1986-07-11 1989-02-02 ボレアリス　ホールディング　アクティーゼルスカブ 重合体組成物
WO2008111239A1 (ja) * 2007-03-12 2008-09-18 Toyo Ink Mfg. Co., Ltd. 帯電防止剤およびその用途

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58108237A (ja) * 1981-12-19 1983-06-28 Toyo Rubber Chem Ind Co Ltd 無帯電性合成樹脂無発泡成型体の製造方法
JPS62141067A (ja) * 1985-12-16 1987-06-24 Toshiba Chem Corp 導電性樹脂組成物
JPH01500277A (ja) * 1986-07-11 1989-02-02 ボレアリス　ホールディング　アクティーゼルスカブ 重合体組成物
JPS6361253U (ja) * 1986-10-07 1988-04-23
WO2008111239A1 (ja) * 2007-03-12 2008-09-18 Toyo Ink Mfg. Co., Ltd. 帯電防止剤およびその用途

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