JPS56167434A - Manufacture of particle board - Google Patents

Manufacture of particle board

Info

Publication number
JPS56167434A
JPS56167434A JP7254480A JP7254480A JPS56167434A JP S56167434 A JPS56167434 A JP S56167434A JP 7254480 A JP7254480 A JP 7254480A JP 7254480 A JP7254480 A JP 7254480A JP S56167434 A JPS56167434 A JP S56167434A
Authority
JP
Japan
Prior art keywords
resin
particle board
heated
small pieces
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7254480A
Other languages
Japanese (ja)
Inventor
Takao Kajiwara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Gakki Co Ltd
Original Assignee
Nippon Gakki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Gakki Co Ltd filed Critical Nippon Gakki Co Ltd
Priority to JP7254480A priority Critical patent/JPS56167434A/en
Publication of JPS56167434A publication Critical patent/JPS56167434A/en
Pending legal-status Critical Current

Links

Landscapes

  • Dry Formation Of Fiberboard And The Like (AREA)

Abstract

PURPOSE: To form a resin layer for coating as well as the molding of a particle board and enable coating by normal paints by a method wherein liquefied resin not hardened is applied on an inner surface of a forming die, woody thin small pieces to which adhesives are applied are filled into the forming die and the small pieces are heated and clamped by pressure.
CONSTITUTION: Liquefied resin 3 not hardened is applied on the inner surfaces of a metal die 1 and a metal die 2 of approximate 1mm thickness, both metal dies are heated and the resin is brought to a semihard condition. A material 4 obtained by applying adhesives to wood thin small pieces is filled in the metal dies, heated and clamped by pressure and a particle board molding is formed. With the particle board obtained, the surface is densely formed with hard resin, and the surface can further be coated and finished with normal synthetic resin paints. Its shape is not limited only to a laminar form by selecting the forming dies, and a three-dimensional object can also be formed freely.
COPYRIGHT: (C)1981,JPO&Japio
JP7254480A 1980-05-30 1980-05-30 Manufacture of particle board Pending JPS56167434A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7254480A JPS56167434A (en) 1980-05-30 1980-05-30 Manufacture of particle board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7254480A JPS56167434A (en) 1980-05-30 1980-05-30 Manufacture of particle board

Publications (1)

Publication Number Publication Date
JPS56167434A true JPS56167434A (en) 1981-12-23

Family

ID=13492399

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7254480A Pending JPS56167434A (en) 1980-05-30 1980-05-30 Manufacture of particle board

Country Status (1)

Country Link
JP (1) JPS56167434A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121010A (en) * 1985-11-22 1987-06-02 Eidai Co Ltd Manufacture of decorative board having embossment
JPS62124943A (en) * 1985-11-26 1987-06-06 永大産業株式会社 Manufacture of decorative board with irregular pattern

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62121010A (en) * 1985-11-22 1987-06-02 Eidai Co Ltd Manufacture of decorative board having embossment
JPS62124943A (en) * 1985-11-26 1987-06-06 永大産業株式会社 Manufacture of decorative board with irregular pattern
JPH0475801B2 (en) * 1985-11-26 1992-12-01 Eidai Co Ltd

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