JPS56165331A - Predicting device for material feeding limits - Google Patents

Predicting device for material feeding limits

Info

Publication number
JPS56165331A
JPS56165331A JP6895580A JP6895580A JPS56165331A JP S56165331 A JPS56165331 A JP S56165331A JP 6895580 A JP6895580 A JP 6895580A JP 6895580 A JP6895580 A JP 6895580A JP S56165331 A JPS56165331 A JP S56165331A
Authority
JP
Japan
Prior art keywords
detecting
wire
pinched
assembling
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6895580A
Other languages
Japanese (ja)
Inventor
Michio Okamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP6895580A priority Critical patent/JPS56165331A/en
Publication of JPS56165331A publication Critical patent/JPS56165331A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H01L2224/78621—Holding means, e.g. wire clampers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to monitor a plurality of assembling the processing devices by an operator by a method wherein a material is pinched by a pair of detecting plates, a warning signal for the material feeding limits is given by electrically detecting the presence or absence of the pinched material and the operation of assembling and processing devices is discontinued. CONSTITUTION:The wire 2, which is unwound and sent from the outer circumference of a spool 4, is inserted in a trampet-shaped guide tube 7 and is brought to a capillary 1 passing between the pair of detecting plates 10 on a detecting section 9. A current is sent to the pair of detecting plates while the wire 2 is pinched between them. This current is detected by a detecting section 18 and a signal is outputted to the indicating section 20 such as a lamp and the like. When no wire exists or a wire breakage occurs, no current is applied to the detecting section and this state is indicated at the indicating section 20. Through these procedures, the feeding condition of material can be clearly seen at a glance and the control of a plurality of assembling and processing devices can be performed by a single operator.
JP6895580A 1980-05-26 1980-05-26 Predicting device for material feeding limits Pending JPS56165331A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6895580A JPS56165331A (en) 1980-05-26 1980-05-26 Predicting device for material feeding limits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6895580A JPS56165331A (en) 1980-05-26 1980-05-26 Predicting device for material feeding limits

Publications (1)

Publication Number Publication Date
JPS56165331A true JPS56165331A (en) 1981-12-18

Family

ID=13388595

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6895580A Pending JPS56165331A (en) 1980-05-26 1980-05-26 Predicting device for material feeding limits

Country Status (1)

Country Link
JP (1) JPS56165331A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066952U (en) * 1983-10-05 1985-05-13 東京瓦斯株式会社 Incomplete combustion safety device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6066952U (en) * 1983-10-05 1985-05-13 東京瓦斯株式会社 Incomplete combustion safety device

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