|
US5202574A
(en)
*
|
1980-05-02 |
1993-04-13 |
Texas Instruments Incorporated |
Semiconductor having improved interlevel conductor insulation
|
|
US4485551A
(en)
*
|
1981-03-02 |
1984-12-04 |
Rockwell International Corporation |
NPN Type lateral transistor separated from substrate by O.D.E. for minimal interference therefrom and method for producing same
|
|
FR2501912A1
(fr)
*
|
1981-03-13 |
1982-09-17 |
Efcis |
Transistor bipolaire lateral sur isolant et son procede de fabrication
|
|
US4518981A
(en)
*
|
1981-11-12 |
1985-05-21 |
Advanced Micro Devices, Inc. |
Merged platinum silicide fuse and Schottky diode and method of manufacture thereof
|
|
US4431460A
(en)
*
|
1982-03-08 |
1984-02-14 |
International Business Machines Corporation |
Method of producing shallow, narrow base bipolar transistor structures via dual implantations of selected polycrystalline layer
|
|
JPS5940571A
(ja)
*
|
1982-08-30 |
1984-03-06 |
Hitachi Ltd |
半導体装置
|
|
US4558507A
(en)
*
|
1982-11-12 |
1985-12-17 |
Nec Corporation |
Method of manufacturing semiconductor device
|
|
US4507848A
(en)
*
|
1982-11-22 |
1985-04-02 |
Fairchild Camera & Instrument Corporation |
Control of substrate injection in lateral bipolar transistors
|
|
US4547959A
(en)
*
|
1983-02-22 |
1985-10-22 |
General Motors Corporation |
Uses for buried contacts in integrated circuits
|
|
JPS6017956A
(ja)
*
|
1983-07-11 |
1985-01-29 |
Agency Of Ind Science & Technol |
耐放射線半導体素子
|
|
US4641170A
(en)
*
|
1983-12-12 |
1987-02-03 |
International Business Machines Corporation |
Self-aligned lateral bipolar transistors
|
|
US4874720A
(en)
*
|
1984-06-25 |
1989-10-17 |
Texas Instruments Incorporated |
Method of making a metal-gate MOS VLSI device
|
|
US5098854A
(en)
*
|
1984-07-09 |
1992-03-24 |
National Semiconductor Corporation |
Process for forming self-aligned silicide base contact for bipolar transistor
|
|
US4577392A
(en)
*
|
1984-08-03 |
1986-03-25 |
Advanced Micro Devices, Inc. |
Fabrication technique for integrated circuits
|
|
US5227316A
(en)
*
|
1985-01-22 |
1993-07-13 |
National Semiconductor Corporation |
Method of forming self aligned extended base contact for a bipolar transistor having reduced cell size
|
|
DE3688711T2
(de)
*
|
1985-03-07 |
1993-12-16 |
Toshiba Kawasaki Kk |
Integrierte Halbleiterschaltungsanordnung und Verfahren zu ihrer Herstellung.
|
|
US4803539A
(en)
*
|
1985-03-29 |
1989-02-07 |
International Business Machines Corporation |
Dopant control of metal silicide formation
|
|
FR2581248B1
(fr)
*
|
1985-04-26 |
1987-05-29 |
Efcis |
Procede de fabrication de transistors a effet de champ et transistors bipolaires lateraux sur un meme substrat
|
|
US4682409A
(en)
*
|
1985-06-21 |
1987-07-28 |
Advanced Micro Devices, Inc. |
Fast bipolar transistor for integrated circuit structure and method for forming same
|
|
US4686763A
(en)
*
|
1985-10-02 |
1987-08-18 |
Advanced Micro Devices, Inc. |
Method of making a planar polysilicon bipolar device
|
|
US4688314A
(en)
*
|
1985-10-02 |
1987-08-25 |
Advanced Micro Devices, Inc. |
Method of making a planar MOS device in polysilicon
|
|
US4860085A
(en)
*
|
1986-06-06 |
1989-08-22 |
American Telephone And Telegraph Company, At&T Bell Laboratories |
Submicron bipolar transistor with buried silicide region
|
|
US4974046A
(en)
*
|
1986-07-02 |
1990-11-27 |
National Seimconductor Corporation |
Bipolar transistor with polysilicon stringer base contact
|
|
US5063168A
(en)
*
|
1986-07-02 |
1991-11-05 |
National Semiconductor Corporation |
Process for making bipolar transistor with polysilicon stringer base contact
|
|
US4788160A
(en)
*
|
1987-03-31 |
1988-11-29 |
Texas Instruments Incorporated |
Process for formation of shallow silicided junctions
|
|
US4816423A
(en)
*
|
1987-05-01 |
1989-03-28 |
Texas Instruments Incorporated |
Bicmos process for forming shallow npn emitters and mosfet source/drains
|
|
US5059546A
(en)
*
|
1987-05-01 |
1991-10-22 |
Texas Instruments Incorporated |
BICMOS process for forming shallow NPN emitters and mosfet source/drains
|
|
US5005066A
(en)
*
|
1987-06-02 |
1991-04-02 |
Texas Instruments Incorporated |
Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology
|
|
US4784966A
(en)
*
|
1987-06-02 |
1988-11-15 |
Texas Instruments Incorporated |
Self-aligned NPN bipolar transistor built in a double polysilicon CMOS technology
|
|
US4803175A
(en)
*
|
1987-09-14 |
1989-02-07 |
Motorola Inc. |
Method of fabricating a bipolar semiconductor device with silicide contacts
|
|
US5258644A
(en)
*
|
1988-02-24 |
1993-11-02 |
Hitachi, Ltd. |
Semiconductor device and method of manufacture thereof
|
|
US5208472A
(en)
*
|
1988-05-13 |
1993-05-04 |
Industrial Technology Research Institute |
Double spacer salicide MOS device and method
|
|
US5397912A
(en)
*
|
1991-12-02 |
1995-03-14 |
Motorola, Inc. |
Lateral bipolar transistor
|
|
DE4309898B4
(de)
*
|
1992-03-30 |
2005-11-03 |
Rohm Co. Ltd. |
Verfahren zur Herstellung eines Bipolartransistors mit einer Polysiliziumschicht zwischen einem Halbleiterbereich und einem Oberflächenelektrodenmetall
|
|
US5539233A
(en)
*
|
1993-07-22 |
1996-07-23 |
Texas Instruments Incorporated |
Controlled low collector breakdown voltage vertical transistor for ESD protection circuits
|
|
US5949114A
(en)
|
1996-11-07 |
1999-09-07 |
Micron Technology, Inc. |
Semiconductor device having increased breakdown voltage and method of fabricating same
|
|
US8669554B2
(en)
|
2006-05-10 |
2014-03-11 |
Ho-Yuan Yu |
Fast recovery reduced p-n junction rectifier
|
|
US7880166B2
(en)
*
|
2006-05-10 |
2011-02-01 |
Ho-Yuan Yu |
Fast recovery reduced p-n junction rectifier
|
|
US7795103B2
(en)
*
|
2006-05-19 |
2010-09-14 |
Ho-Yuan Yu |
Bipolar transistors with depleted emitter
|
|
US8110835B2
(en)
*
|
2007-04-19 |
2012-02-07 |
Luminus Devices, Inc. |
Switching device integrated with light emitting device
|
|
US8362703B2
(en)
*
|
2007-12-20 |
2013-01-29 |
Luminus Devices, Inc. |
Light-emitting devices
|