JPS56156748A - Pretreating solution for electroless plating - Google Patents

Pretreating solution for electroless plating

Info

Publication number
JPS56156748A
JPS56156748A JP6026780A JP6026780A JPS56156748A JP S56156748 A JPS56156748 A JP S56156748A JP 6026780 A JP6026780 A JP 6026780A JP 6026780 A JP6026780 A JP 6026780A JP S56156748 A JPS56156748 A JP S56156748A
Authority
JP
Japan
Prior art keywords
soln
electroless plating
plated
sensitizing
washing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6026780A
Other languages
Japanese (ja)
Inventor
Atsuo Senda
Toru Kasatsugu
Takuji Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Priority to JP6026780A priority Critical patent/JPS56156748A/en
Publication of JPS56156748A publication Critical patent/JPS56156748A/en
Pending legal-status Critical Current

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Abstract

PURPOSE: To form a high quality plated coat by electroless plating without causing defective throwing and uneven plating by adding metallic cations to at least one of a sensitizing soln. and an activating soln. used in a pretreating process for electroless plating.
CONSTITUTION: When a substrate of a nonconductor of electricity such as ceramics is plated, the substrate surface is cleaned and made hydrophilic degreasing, washing, etching and washing. It is then sensitized with a mixed aqueous soln. of stannous chloride and hydrochoric acid, activated with a mixed aqueous soln. of palladium chloride and hydrochloric acid, and immersed in an electroless plating soln. of Ni or Cu to form a plated coat on the surface. At this time, by adding metallic cations of Li, Na, K, Ca, Sr, Ba, Fe, Co, Ni or the like except Sn and Pd to the sensitizing or activating soln., a high quality plated coat is formed.
COPYRIGHT: (C)1981,JPO&Japio
JP6026780A 1980-05-06 1980-05-06 Pretreating solution for electroless plating Pending JPS56156748A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6026780A JPS56156748A (en) 1980-05-06 1980-05-06 Pretreating solution for electroless plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6026780A JPS56156748A (en) 1980-05-06 1980-05-06 Pretreating solution for electroless plating

Publications (1)

Publication Number Publication Date
JPS56156748A true JPS56156748A (en) 1981-12-03

Family

ID=13137193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6026780A Pending JPS56156748A (en) 1980-05-06 1980-05-06 Pretreating solution for electroless plating

Country Status (1)

Country Link
JP (1) JPS56156748A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109981A (en) * 1985-11-07 1987-05-21 Daicel Chem Ind Ltd Electroless nickel plating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62109981A (en) * 1985-11-07 1987-05-21 Daicel Chem Ind Ltd Electroless nickel plating method

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