JPS56155272A - Pressure-sensitive adhesive composition - Google Patents
Pressure-sensitive adhesive compositionInfo
- Publication number
- JPS56155272A JPS56155272A JP5931180A JP5931180A JPS56155272A JP S56155272 A JPS56155272 A JP S56155272A JP 5931180 A JP5931180 A JP 5931180A JP 5931180 A JP5931180 A JP 5931180A JP S56155272 A JPS56155272 A JP S56155272A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- pressure
- sensitive adhesive
- microcapsule
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: A pressure-sensitive adhesive of reduced cost and with slightly lowered adhesive force, which is prepared by incorporating a microcapsule deformable by an external force and contg. a viscous material as the core body, with an pressure- sensitive adhesive.
CONSTITUTION: A microcapusle contg. a liquid or fluid viscous material as the core boty and being deformable by an external force, is incorporated with a pressure-sensitive adhesive. Although an adequate ratio of the microcapsule to the adhesive depends on the property of the adhesive used, it is possible to incorporate the microcapsule in a ratio of 1:99W80:20. For example, the amt. of the microcapsule is to be 50% or lower in the case of a permanent type adhesive, but it is possible to incorporated as much as about 80% in the case of a removable type adhesive.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5931180A JPS56155272A (en) | 1980-05-01 | 1980-05-01 | Pressure-sensitive adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5931180A JPS56155272A (en) | 1980-05-01 | 1980-05-01 | Pressure-sensitive adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56155272A true JPS56155272A (en) | 1981-12-01 |
Family
ID=13109691
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5931180A Pending JPS56155272A (en) | 1980-05-01 | 1980-05-01 | Pressure-sensitive adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56155272A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02102280A (en) * | 1988-10-07 | 1990-04-13 | Matsumoto Yushi Seiyaku Co Ltd | Microencapsulated self-adhesive |
| WO1996007708A1 (en) * | 1994-09-07 | 1996-03-14 | The Mead Corporation | Microcapsule-containing cohesive coating |
| WO1998033860A1 (en) * | 1997-02-05 | 1998-08-06 | H.B. Fuller Licensing & Financing, Inc. | Hot melt adhesive comprising an encapsulated ingredient |
| CN109796895A (en) * | 2018-12-28 | 2019-05-24 | 北京印刷学院 | Degradable adhesive tape and preparation method thereof |
-
1980
- 1980-05-01 JP JP5931180A patent/JPS56155272A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02102280A (en) * | 1988-10-07 | 1990-04-13 | Matsumoto Yushi Seiyaku Co Ltd | Microencapsulated self-adhesive |
| WO1996007708A1 (en) * | 1994-09-07 | 1996-03-14 | The Mead Corporation | Microcapsule-containing cohesive coating |
| WO1998033860A1 (en) * | 1997-02-05 | 1998-08-06 | H.B. Fuller Licensing & Financing, Inc. | Hot melt adhesive comprising an encapsulated ingredient |
| CN109796895A (en) * | 2018-12-28 | 2019-05-24 | 北京印刷学院 | Degradable adhesive tape and preparation method thereof |
| CN109796895B (en) * | 2018-12-28 | 2021-10-15 | 北京印刷学院 | Degradable adhesive tape and preparation method thereof |
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