JPS56154168U - - Google Patents

Info

Publication number
JPS56154168U
JPS56154168U JP1980051652U JP5165280U JPS56154168U JP S56154168 U JPS56154168 U JP S56154168U JP 1980051652 U JP1980051652 U JP 1980051652U JP 5165280 U JP5165280 U JP 5165280U JP S56154168 U JPS56154168 U JP S56154168U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980051652U
Other languages
Japanese (ja)
Other versions
JPS6120757Y2 (enExample
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980051652U priority Critical patent/JPS6120757Y2/ja
Publication of JPS56154168U publication Critical patent/JPS56154168U/ja
Application granted granted Critical
Publication of JPS6120757Y2 publication Critical patent/JPS6120757Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/50Bond wires
    • H10W72/531Shapes of wire connectors
    • H10W72/5363Shapes of wire connectors the connected ends being wedge-shaped
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/851Dispositions of multiple connectors or interconnections
    • H10W72/874On different surfaces
    • H10W72/884Die-attach connectors and bond wires
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00Encapsulations, e.g. protective coatings

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1980051652U 1980-04-14 1980-04-14 Expired JPS6120757Y2 (enExample)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980051652U JPS6120757Y2 (enExample) 1980-04-14 1980-04-14

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980051652U JPS6120757Y2 (enExample) 1980-04-14 1980-04-14

Publications (2)

Publication Number Publication Date
JPS56154168U true JPS56154168U (enExample) 1981-11-18
JPS6120757Y2 JPS6120757Y2 (enExample) 1986-06-21

Family

ID=29646549

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980051652U Expired JPS6120757Y2 (enExample) 1980-04-14 1980-04-14

Country Status (1)

Country Link
JP (1) JPS6120757Y2 (enExample)

Also Published As

Publication number Publication date
JPS6120757Y2 (enExample) 1986-06-21

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