JPS56145929A - Preparation of conductive acetylene high polymer molded item having excellent oxidation stability - Google Patents
Preparation of conductive acetylene high polymer molded item having excellent oxidation stabilityInfo
- Publication number
- JPS56145929A JPS56145929A JP4864480A JP4864480A JPS56145929A JP S56145929 A JPS56145929 A JP S56145929A JP 4864480 A JP4864480 A JP 4864480A JP 4864480 A JP4864480 A JP 4864480A JP S56145929 A JPS56145929 A JP S56145929A
- Authority
- JP
- Japan
- Prior art keywords
- molded item
- high polymer
- polymer molded
- acetylene high
- oxidation stability
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Photovoltaic Devices (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
PURPOSE: To prepare the titled high polymer molded item, being useful as an organic semiconductor material for preparing parts of electronic equipment, by sealing a conductive acetylene high polymer molded item with a sealing medium.
CONSTITUTION: A conductive acetylene high polymer molded item having excellent oxidation stability is obtained by sealing an acetylene high polymer molded item having a bulk density of 0.7W1.2g/cm3, or an acetylene high polymer molded item of high electric conductivity prepared by doping said acetylene high polymer molded item with an electron accepting compound (e.g. Cl2, SbF5, SiF4, etc.) or electron donating compound (e.g. Na, K, etc.), with a sealing medium (e.g. solid paraffin, polyethylene, PVC, etc.).
USE: Said molded item is used as an organic semiconductor material for preparing parts of electronic equipment such as electric resistance elements, heat sensitive ones, photosensitive ones, and so on.
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4864480A JPS56145929A (en) | 1980-04-15 | 1980-04-15 | Preparation of conductive acetylene high polymer molded item having excellent oxidation stability |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4864480A JPS56145929A (en) | 1980-04-15 | 1980-04-15 | Preparation of conductive acetylene high polymer molded item having excellent oxidation stability |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56145929A true JPS56145929A (en) | 1981-11-13 |
JPS6341164B2 JPS6341164B2 (en) | 1988-08-16 |
Family
ID=12809065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4864480A Granted JPS56145929A (en) | 1980-04-15 | 1980-04-15 | Preparation of conductive acetylene high polymer molded item having excellent oxidation stability |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56145929A (en) |
-
1980
- 1980-04-15 JP JP4864480A patent/JPS56145929A/en active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6341164B2 (en) | 1988-08-16 |
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