JPS56142431A - Pressure sensor - Google Patents

Pressure sensor

Info

Publication number
JPS56142431A
JPS56142431A JP3446181A JP3446181A JPS56142431A JP S56142431 A JPS56142431 A JP S56142431A JP 3446181 A JP3446181 A JP 3446181A JP 3446181 A JP3446181 A JP 3446181A JP S56142431 A JPS56142431 A JP S56142431A
Authority
JP
Japan
Prior art keywords
pressure sensor
sensor
pressure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3446181A
Other languages
English (en)
Japanese (ja)
Inventor
Kurauze Rainaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPS56142431A publication Critical patent/JPS56142431A/ja
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
JP3446181A 1980-03-10 1981-03-10 Pressure sensor Pending JPS56142431A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19803009163 DE3009163A1 (de) 1980-03-10 1980-03-10 Messwertaufnehmer fuer druck

Publications (1)

Publication Number Publication Date
JPS56142431A true JPS56142431A (en) 1981-11-06

Family

ID=6096770

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3446181A Pending JPS56142431A (en) 1980-03-10 1981-03-10 Pressure sensor

Country Status (2)

Country Link
JP (1) JPS56142431A (enrdf_load_stackoverflow)
DE (1) DE3009163A1 (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889873A (ja) * 1981-11-24 1983-05-28 Nippon Denso Co Ltd 半導体圧力変換器
JP2006272325A (ja) * 2005-03-03 2006-10-12 Air Water Inc ガス分離方法およびそれに用いる装置
JP2009053005A (ja) * 2007-08-27 2009-03-12 Hitachi Metals Ltd 半導体歪センサーおよび半導体歪センサーの取付け方法
US8438931B2 (en) 2007-08-27 2013-05-14 Hitachi, Ltd. Semiconductor strain sensor

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0140992B1 (de) * 1983-11-10 1988-05-25 Kristal Instrumente AG Wandlerelement, Verfahren zu seiner Herstellung sowie Verwendung für einen Druckaufnehmer
DE4207848A1 (de) * 1992-03-12 1993-09-16 Jenoptik Jena Gmbh Einrichtung zur kraft- und druckmessung in mindestens einer komponente

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5112437B2 (enrdf_load_stackoverflow) * 1971-10-01 1976-04-19
DE2617731C3 (de) * 1976-04-23 1979-06-07 Siemens Ag, 1000 Berlin Und 8000 Muenchen Miniaturdruckmeßwandler

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5889873A (ja) * 1981-11-24 1983-05-28 Nippon Denso Co Ltd 半導体圧力変換器
JP2006272325A (ja) * 2005-03-03 2006-10-12 Air Water Inc ガス分離方法およびそれに用いる装置
JP2009053005A (ja) * 2007-08-27 2009-03-12 Hitachi Metals Ltd 半導体歪センサーおよび半導体歪センサーの取付け方法
US8438931B2 (en) 2007-08-27 2013-05-14 Hitachi, Ltd. Semiconductor strain sensor

Also Published As

Publication number Publication date
DE3009163C2 (enrdf_load_stackoverflow) 1989-03-09
DE3009163A1 (de) 1981-09-24

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