JPS56133116A - Supporting body for plastic molding - Google Patents

Supporting body for plastic molding

Info

Publication number
JPS56133116A
JPS56133116A JP3566280A JP3566280A JPS56133116A JP S56133116 A JPS56133116 A JP S56133116A JP 3566280 A JP3566280 A JP 3566280A JP 3566280 A JP3566280 A JP 3566280A JP S56133116 A JPS56133116 A JP S56133116A
Authority
JP
Japan
Prior art keywords
layer
metallic
semiconductor layers
molded body
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3566280A
Other languages
Japanese (ja)
Inventor
Kaneo Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP3566280A priority Critical patent/JPS56133116A/en
Publication of JPS56133116A publication Critical patent/JPS56133116A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/72—Heating or cooling
    • B29C45/73—Heating or cooling of the mould

Abstract

PURPOSE: To conduct heating and cooling of a molded body with lesser energy, by forming semiconductor layers and metallic layers which connect the semiconductor layers on a surface of a supporting body for plastic molding and elevating and lowering the surface temperature by means of Peltier effect.
CONSTITUTION: Upon a cavity 1 with which a molded body 4 makes contact when a plastic molded body is molded, an electrically insulating layer 8' is formed, and upon it P type semiconductor layers 5 and N type semiconductor layers 6 using such semiconductors as Bi2Te3, PbTe or the like are formed with metallic layers 7, 7' connecting spaces between both semiconductor layers altermately. Further upon them an electrically insulating layer 8 and a metallic surface layer 3 are formed. When a direct current source is connected so that a direct current flows in the order of the P type semiconductor layer 5 and the N type semiconductor layer 6, the metallic layer 7' generates heat by means of the Peltier effect. When connected reversely, the metallic layer 7' absorbs heat. Therefore, the molded body 4 is either heated or cooled by the elevating or lowering of the metallic layer 3 by means of the Peltier effect.
COPYRIGHT: (C)1981,JPO&Japio
JP3566280A 1980-03-19 1980-03-19 Supporting body for plastic molding Pending JPS56133116A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3566280A JPS56133116A (en) 1980-03-19 1980-03-19 Supporting body for plastic molding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3566280A JPS56133116A (en) 1980-03-19 1980-03-19 Supporting body for plastic molding

Publications (1)

Publication Number Publication Date
JPS56133116A true JPS56133116A (en) 1981-10-19

Family

ID=12448076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3566280A Pending JPS56133116A (en) 1980-03-19 1980-03-19 Supporting body for plastic molding

Country Status (1)

Country Link
JP (1) JPS56133116A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136678A1 (en) * 2001-07-27 2003-02-13 Battenfeld Gmbh Module for a tool cavity, especially in an injection molding tool, comprises a base carrier which has at least two layers, and a third, electrically insulated layer
DE102008022075A1 (en) * 2008-05-03 2009-11-05 Kraussmaffei Technologies Gmbh Mold part for injection molding/reaction injection molding machine for production of plastic article, has peltier elements for tempering of cavity surface provided in mold part, and ceramics layer arranged between baseplate and metal layer
EP2222427A1 (en) * 2007-11-29 2010-09-01 Husky Injection Molding Systems S.A. A gate insert
CN115235682A (en) * 2022-09-21 2022-10-25 无锡芯感智半导体有限公司 Packaging structure and method of MEMS pressure sensor

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833630A (en) * 1971-08-24 1973-05-11

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4833630A (en) * 1971-08-24 1973-05-11

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10136678A1 (en) * 2001-07-27 2003-02-13 Battenfeld Gmbh Module for a tool cavity, especially in an injection molding tool, comprises a base carrier which has at least two layers, and a third, electrically insulated layer
DE10136678B4 (en) * 2001-07-27 2004-09-30 Battenfeld Gmbh Heating a mold cavity of an injection mold
EP2222427A1 (en) * 2007-11-29 2010-09-01 Husky Injection Molding Systems S.A. A gate insert
EP2222427A4 (en) * 2007-11-29 2011-03-09 Husky Injection Molding A gate insert
DE102008022075A1 (en) * 2008-05-03 2009-11-05 Kraussmaffei Technologies Gmbh Mold part for injection molding/reaction injection molding machine for production of plastic article, has peltier elements for tempering of cavity surface provided in mold part, and ceramics layer arranged between baseplate and metal layer
CN115235682A (en) * 2022-09-21 2022-10-25 无锡芯感智半导体有限公司 Packaging structure and method of MEMS pressure sensor

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