JPS56129454A - Remote monitor system - Google Patents

Remote monitor system

Info

Publication number
JPS56129454A
JPS56129454A JP3267480A JP3267480A JPS56129454A JP S56129454 A JPS56129454 A JP S56129454A JP 3267480 A JP3267480 A JP 3267480A JP 3267480 A JP3267480 A JP 3267480A JP S56129454 A JPS56129454 A JP S56129454A
Authority
JP
Japan
Prior art keywords
circuit
monitored
stations
output
sequentially
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3267480A
Other languages
Japanese (ja)
Inventor
Masataka Shimomura
Hideyasu Hashiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3267480A priority Critical patent/JPS56129454A/en
Publication of JPS56129454A publication Critical patent/JPS56129454A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Small-Scale Networks (AREA)
  • Selective Calling Equipment (AREA)

Abstract

PURPOSE:To make small the size of a remote monitor system, by installing the cyclic digital transmission line to each of monitored stations and selecting one monitored station only sequentially by the monitor station. CONSTITUTION:Cyclic digital transmission circuits 1, 2, 3 are installed to a number of stations to be monitored. The output of the transmission circuits 1-3 is sequentially selected at the switch circuit 4 to feed it to the cyclic digital reception circuit 13 of monitor station. The serial parallel conversion circuit 14 of the reception circuit 13 outputs the input data 10-12 of the stations to be monitored corresponding to the latch circuit 24 with the output of the channel selection detection circuit 22 sequentially operated at the swtich circuit 21 in interlocking with the switch circuit 14, as the output data 25-27. Thus, the function to prevent the competition among stations to be monitored is not requried for the monitor station and the entire system can be made small in size.
JP3267480A 1980-03-17 1980-03-17 Remote monitor system Pending JPS56129454A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3267480A JPS56129454A (en) 1980-03-17 1980-03-17 Remote monitor system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3267480A JPS56129454A (en) 1980-03-17 1980-03-17 Remote monitor system

Publications (1)

Publication Number Publication Date
JPS56129454A true JPS56129454A (en) 1981-10-09

Family

ID=12365413

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3267480A Pending JPS56129454A (en) 1980-03-17 1980-03-17 Remote monitor system

Country Status (1)

Country Link
JP (1) JPS56129454A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5483374A (en) * 1977-12-16 1979-07-03 Hitachi Ltd Chip bonding process

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5483374A (en) * 1977-12-16 1979-07-03 Hitachi Ltd Chip bonding process

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