JPS56125199A - Manufacture for ultrasonic wave probe - Google Patents

Manufacture for ultrasonic wave probe

Info

Publication number
JPS56125199A
JPS56125199A JP2962180A JP2962180A JPS56125199A JP S56125199 A JPS56125199 A JP S56125199A JP 2962180 A JP2962180 A JP 2962180A JP 2962180 A JP2962180 A JP 2962180A JP S56125199 A JPS56125199 A JP S56125199A
Authority
JP
Japan
Prior art keywords
oscillator
electrode
sticked
split
packing member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2962180A
Other languages
Japanese (ja)
Other versions
JPS6312439B2 (en
Inventor
Yuji Shinguu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2962180A priority Critical patent/JPS56125199A/en
Publication of JPS56125199A publication Critical patent/JPS56125199A/en
Publication of JPS6312439B2 publication Critical patent/JPS6312439B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

PURPOSE:To increase the productivity and to enable to reduce the crack of oscillator during manufacture, by splitting sticked oscillator to the intermediate medium layer into several numbers and sticking them to the packing member after connecting leads to the split oscillators. CONSTITUTION:The plane of electrode 3 of the oscillator 1 consisting of piezoelectric element forming electrodes 2, 3 at the both sides is sticked to the intermediate medium layer 5 of 1/4 wave length, which spreads the frequency band providing the common electrode layer 4 and improves the transient response to pulse drive. Then, the oscillator 1 is split into several pieces so that the electrode 3 has notches, and the end of the electrode 2 of the oscillator 1 split individually is connected with the leads 6. With this constitution, the electrode 2 of the oscillator 1 is sticked on the packing member 7 playing a role of oscillation damping and acoustic wave absorption. One end on the packing member 7 is chamferred so that the conductive adhesive connected to the lead 6 and solder and lead 6 are made free.
JP2962180A 1980-03-07 1980-03-07 Manufacture for ultrasonic wave probe Granted JPS56125199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2962180A JPS56125199A (en) 1980-03-07 1980-03-07 Manufacture for ultrasonic wave probe

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2962180A JPS56125199A (en) 1980-03-07 1980-03-07 Manufacture for ultrasonic wave probe

Publications (2)

Publication Number Publication Date
JPS56125199A true JPS56125199A (en) 1981-10-01
JPS6312439B2 JPS6312439B2 (en) 1988-03-18

Family

ID=12281150

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2962180A Granted JPS56125199A (en) 1980-03-07 1980-03-07 Manufacture for ultrasonic wave probe

Country Status (1)

Country Link
JP (1) JPS56125199A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109942A (en) * 2010-10-27 2012-06-07 Nippon Dempa Kogyo Co Ltd Ultrasonic probe and manufacturing method for the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012109942A (en) * 2010-10-27 2012-06-07 Nippon Dempa Kogyo Co Ltd Ultrasonic probe and manufacturing method for the same

Also Published As

Publication number Publication date
JPS6312439B2 (en) 1988-03-18

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