JPS56123572U - - Google Patents
Info
- Publication number
- JPS56123572U JPS56123572U JP1980020723U JP2072380U JPS56123572U JP S56123572 U JPS56123572 U JP S56123572U JP 1980020723 U JP1980020723 U JP 1980020723U JP 2072380 U JP2072380 U JP 2072380U JP S56123572 U JPS56123572 U JP S56123572U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980020723U JPS56123572U (https=) | 1980-02-20 | 1980-02-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980020723U JPS56123572U (https=) | 1980-02-20 | 1980-02-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS56123572U true JPS56123572U (https=) | 1981-09-19 |
Family
ID=29616911
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980020723U Pending JPS56123572U (https=) | 1980-02-20 | 1980-02-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56123572U (https=) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005303211A (ja) * | 2004-04-15 | 2005-10-27 | Stanley Electric Co Ltd | 平面照射型ｌｅｄ |
| JP2005317977A (ja) * | 2004-04-29 | 2005-11-10 | Lg Phillips Lcd Co Ltd | Ｌｅｄランプユニット |
| JP2010003941A (ja) * | 2008-06-23 | 2010-01-07 | Mitsubishi Electric Corp | Ｌｅｄ光源、面状光源装置および表示装置 |
| JP2011044756A (ja) * | 2005-07-26 | 2011-03-03 | Samsung Led Co Ltd | 拡散材料を用いたｌｅｄパッケージ及びその製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124866B1 (https=) * | 1969-03-22 | 1976-07-27 |
-
1980
- 1980-02-20 JP JP1980020723U patent/JPS56123572U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5124866B1 (https=) * | 1969-03-22 | 1976-07-27 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005303211A (ja) * | 2004-04-15 | 2005-10-27 | Stanley Electric Co Ltd | 平面照射型ｌｅｄ |
| JP2005317977A (ja) * | 2004-04-29 | 2005-11-10 | Lg Phillips Lcd Co Ltd | Ｌｅｄランプユニット |
| JP2011044756A (ja) * | 2005-07-26 | 2011-03-03 | Samsung Led Co Ltd | 拡散材料を用いたｌｅｄパッケージ及びその製造方法 |
| JP2010003941A (ja) * | 2008-06-23 | 2010-01-07 | Mitsubishi Electric Corp | Ｌｅｄ光源、面状光源装置および表示装置 |