JPS56122131A - Resin-sealed type semiconductor device - Google Patents

Resin-sealed type semiconductor device

Info

Publication number
JPS56122131A
JPS56122131A JP2513880A JP2513880A JPS56122131A JP S56122131 A JPS56122131 A JP S56122131A JP 2513880 A JP2513880 A JP 2513880A JP 2513880 A JP2513880 A JP 2513880A JP S56122131 A JPS56122131 A JP S56122131A
Authority
JP
Japan
Prior art keywords
resin
elements
enclosure
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2513880A
Other languages
Japanese (ja)
Inventor
Koji Suzuki
Toshio Aoki
Sachie Kusanagi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2513880A priority Critical patent/JPS56122131A/en
Publication of JPS56122131A publication Critical patent/JPS56122131A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof  ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
    • H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Die Bonding (AREA)

Abstract

PURPOSE:To eliminate the variation in anisotropic resistance of a resin-sealed type semiconductor device by setting a semiconductor pellet in which an N type resistance element of predetermined surface impurity density is formed in a (100) crystalline surface so that the element is directed at 45 deg. of the longitudinal direction of an enclosure and sealing it with the resin. CONSTITUTION:N type resistance elements 12, 13 having 4X10<18>-3X10<20>cm<-3> of surface impurity density are formed in parallel with or perpendicularly to the (100) crystalline axial direction on a semiconductor pellet 11. The elements are placed fixedly on a mount base 16, wire bonded to metallic leads 14, and molded in a rectangular enclosure 15 of insulating resin. At this time the directions of the elements 12, 13 are inclined at 45 deg. with respect to the longitudinal direction of the enclosure. Thus, anisotropic resistance change caused by strain due to the resin sealing can be eliminated to improve the electric characteristics.
JP2513880A 1980-02-29 1980-02-29 Resin-sealed type semiconductor device Pending JPS56122131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2513880A JPS56122131A (en) 1980-02-29 1980-02-29 Resin-sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2513880A JPS56122131A (en) 1980-02-29 1980-02-29 Resin-sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS56122131A true JPS56122131A (en) 1981-09-25

Family

ID=12157603

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2513880A Pending JPS56122131A (en) 1980-02-29 1980-02-29 Resin-sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS56122131A (en)

Similar Documents

Publication Publication Date Title
DE3376166D1 (en) Process for manufacturing an electrical resistor having a polycrystalline semiconductor material, and integrated circuit device comprising this resistor
JPS57188858A (en) Plastic molded type semiconductor device
JPS56122134A (en) Resin-sealed type semiconductor device
US3142000A (en) Matrix for holding and making electrical connection with a plurality of electrical units
JPS56122137A (en) Resin-sealed type semiconductor device
JPS56122132A (en) Resin-sealed type semiconductor device
JPS56122131A (en) Resin-sealed type semiconductor device
JPS56122133A (en) Resin-sealed type semiconductor device
JPS54144872A (en) Electronic circuit device
JPS56122136A (en) Resin-sealed type semiconductor device
JPS56122135A (en) Resin-sealed type semiconductor device
GB1418915A (en) High voltage electrical resistors
GB719126A (en) Improvements in connecting terminal leads to electrical circuit elements
JPS5357971A (en) Production of semiconductor device
JPS53124072A (en) Semiconductor device
JPS5293271A (en) Semiconductor device and its manufacture for that device
EP0348018A3 (en) Resin encapsulated semiconductor device and method of manufacture thereof
JPS5339891A (en) Semiconductor integrated circuit device
JPS56158440A (en) Semiconductor device
JPS5693350A (en) Armor of semiconductor device
JPS5324270A (en) Semiconductor device
JPS5635451A (en) Semiconductor device
JPS5743435A (en) Electronic part
JPS5555543A (en) Method of mounting semiconductor device
ES475731A1 (en) Temperature sensor