JPS56121275U - - Google Patents
Info
- Publication number
- JPS56121275U JPS56121275U JP1980020863U JP2086380U JPS56121275U JP S56121275 U JPS56121275 U JP S56121275U JP 1980020863 U JP1980020863 U JP 1980020863U JP 2086380 U JP2086380 U JP 2086380U JP S56121275 U JPS56121275 U JP S56121275U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
- H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980020863U JPS6125267Y2 (cg-RX-API-DMAC7.html) | 1980-02-19 | 1980-02-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1980020863U JPS6125267Y2 (cg-RX-API-DMAC7.html) | 1980-02-19 | 1980-02-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56121275U true JPS56121275U (cg-RX-API-DMAC7.html) | 1981-09-16 |
| JPS6125267Y2 JPS6125267Y2 (cg-RX-API-DMAC7.html) | 1986-07-29 |
Family
ID=29617045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1980020863U Expired JPS6125267Y2 (cg-RX-API-DMAC7.html) | 1980-02-19 | 1980-02-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6125267Y2 (cg-RX-API-DMAC7.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114954U (cg-RX-API-DMAC7.html) * | 1989-03-01 | 1990-09-14 | ||
| JP2000022222A (ja) * | 1998-07-07 | 2000-01-21 | Stanley Electric Co Ltd | 発光ダイオード |
-
1980
- 1980-02-19 JP JP1980020863U patent/JPS6125267Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02114954U (cg-RX-API-DMAC7.html) * | 1989-03-01 | 1990-09-14 | ||
| JP2000022222A (ja) * | 1998-07-07 | 2000-01-21 | Stanley Electric Co Ltd | 発光ダイオード |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6125267Y2 (cg-RX-API-DMAC7.html) | 1986-07-29 |