JPS56120143A - Pressure insertion method - Google Patents
Pressure insertion methodInfo
- Publication number
- JPS56120143A JPS56120143A JP2304580A JP2304580A JPS56120143A JP S56120143 A JPS56120143 A JP S56120143A JP 2304580 A JP2304580 A JP 2304580A JP 2304580 A JP2304580 A JP 2304580A JP S56120143 A JPS56120143 A JP S56120143A
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- cap
- stem
- insertion mold
- nose
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012966 insertion method Methods 0.000 title 1
- 230000006835 compression Effects 0.000 abstract 4
- 238000007906 compression Methods 0.000 abstract 4
- 238000003780 insertion Methods 0.000 abstract 4
- 239000011521 glass Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2304580A JPS56120143A (en) | 1980-02-25 | 1980-02-25 | Pressure insertion method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2304580A JPS56120143A (en) | 1980-02-25 | 1980-02-25 | Pressure insertion method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56120143A true JPS56120143A (en) | 1981-09-21 |
| JPS6239541B2 JPS6239541B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-24 |
Family
ID=12099475
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2304580A Granted JPS56120143A (en) | 1980-02-25 | 1980-02-25 | Pressure insertion method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56120143A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017216470A (ja) * | 2017-07-21 | 2017-12-07 | 京セラ株式会社 | Ｔｏ−ｃａｎ型パッケージ用ヘッダーおよび半導体装置 |
-
1980
- 1980-02-25 JP JP2304580A patent/JPS56120143A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017216470A (ja) * | 2017-07-21 | 2017-12-07 | 京セラ株式会社 | Ｔｏ−ｃａｎ型パッケージ用ヘッダーおよび半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6239541B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-08-24 |
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