JPS56117562U - - Google Patents
Info
- Publication number
- JPS56117562U JPS56117562U JP1402680U JP1402680U JPS56117562U JP S56117562 U JPS56117562 U JP S56117562U JP 1402680 U JP1402680 U JP 1402680U JP 1402680 U JP1402680 U JP 1402680U JP S56117562 U JPS56117562 U JP S56117562U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1402680U JPS6144456Y2 (xx) | 1980-02-08 | 1980-02-08 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1402680U JPS6144456Y2 (xx) | 1980-02-08 | 1980-02-08 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56117562U true JPS56117562U (xx) | 1981-09-08 |
JPS6144456Y2 JPS6144456Y2 (xx) | 1986-12-15 |
Family
ID=29610527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1402680U Expired JPS6144456Y2 (xx) | 1980-02-08 | 1980-02-08 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6144456Y2 (xx) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01279382A (ja) * | 1988-05-02 | 1989-11-09 | Matsushita Electric Ind Co Ltd | 光学的パターン検出装置及びその製造方法 |
JP2002368286A (ja) * | 2001-06-11 | 2002-12-20 | Citizen Electronics Co Ltd | 発光ダイオード及びその製造方法 |
-
1980
- 1980-02-08 JP JP1402680U patent/JPS6144456Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01279382A (ja) * | 1988-05-02 | 1989-11-09 | Matsushita Electric Ind Co Ltd | 光学的パターン検出装置及びその製造方法 |
JP2002368286A (ja) * | 2001-06-11 | 2002-12-20 | Citizen Electronics Co Ltd | 発光ダイオード及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
JPS6144456Y2 (xx) | 1986-12-15 |