JPS56117562U - - Google Patents

Info

Publication number
JPS56117562U
JPS56117562U JP1980014026U JP1402680U JPS56117562U JP S56117562 U JPS56117562 U JP S56117562U JP 1980014026 U JP1980014026 U JP 1980014026U JP 1402680 U JP1402680 U JP 1402680U JP S56117562 U JPS56117562 U JP S56117562U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1980014026U
Other languages
Japanese (ja)
Other versions
JPS6144456Y2 (cg-RX-API-DMAC7.html
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980014026U priority Critical patent/JPS6144456Y2/ja
Publication of JPS56117562U publication Critical patent/JPS56117562U/ja
Application granted granted Critical
Publication of JPS6144456Y2 publication Critical patent/JPS6144456Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
JP1980014026U 1980-02-08 1980-02-08 Expired JPS6144456Y2 (cg-RX-API-DMAC7.html)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980014026U JPS6144456Y2 (cg-RX-API-DMAC7.html) 1980-02-08 1980-02-08

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980014026U JPS6144456Y2 (cg-RX-API-DMAC7.html) 1980-02-08 1980-02-08

Publications (2)

Publication Number Publication Date
JPS56117562U true JPS56117562U (cg-RX-API-DMAC7.html) 1981-09-08
JPS6144456Y2 JPS6144456Y2 (cg-RX-API-DMAC7.html) 1986-12-15

Family

ID=29610527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980014026U Expired JPS6144456Y2 (cg-RX-API-DMAC7.html) 1980-02-08 1980-02-08

Country Status (1)

Country Link
JP (1) JPS6144456Y2 (cg-RX-API-DMAC7.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279382A (ja) * 1988-05-02 1989-11-09 Matsushita Electric Ind Co Ltd 光学的パターン検出装置及びその製造方法
JP2002368286A (ja) * 2001-06-11 2002-12-20 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01279382A (ja) * 1988-05-02 1989-11-09 Matsushita Electric Ind Co Ltd 光学的パターン検出装置及びその製造方法
JP2002368286A (ja) * 2001-06-11 2002-12-20 Citizen Electronics Co Ltd 発光ダイオード及びその製造方法

Also Published As

Publication number Publication date
JPS6144456Y2 (cg-RX-API-DMAC7.html) 1986-12-15

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