JPS56117175A - Screening device - Google Patents

Screening device

Info

Publication number
JPS56117175A
JPS56117175A JP2011880A JP2011880A JPS56117175A JP S56117175 A JPS56117175 A JP S56117175A JP 2011880 A JP2011880 A JP 2011880A JP 2011880 A JP2011880 A JP 2011880A JP S56117175 A JPS56117175 A JP S56117175A
Authority
JP
Japan
Prior art keywords
jig
slopes
magazine
angles
screening
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2011880A
Other languages
Japanese (ja)
Inventor
Shigenori Kinoshita
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP2011880A priority Critical patent/JPS56117175A/en
Publication of JPS56117175A publication Critical patent/JPS56117175A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals
    • G01R1/0408Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0425Test clips, e.g. for IC's

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

PURPOSE:To improve workability by accurately positioning products to the predetermined positions of a screening device by using the jigs having slopes to be applied on the angles of the outside shape of the products in semiconductor integrated circuit devices of flat package type. CONSTITUTION:When a small flat IC1 inserted in a magazine 6 comes to a take-out position 7, a position-correcting jig 9 having slopes 8 to be applied on the angles of the outside shape of the IC1 descends to stick the IC1. Thence, the jig 9 moves the IC1 to a screening part 10, places its leads on electrodes 11 and performs screening work. Hence, even if the position of the IC1 is deviating in the housing part of the magazine 6, the position may be corrected by the slopes 8 of the jig 9, and the IC1 may be stock always accurately to the center of the jig 9, whereby the workability is improved. It is also possible to prevent the electrostatic breakdown of the IC1 by making the magazine 6 conductive.
JP2011880A 1980-02-20 1980-02-20 Screening device Pending JPS56117175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011880A JPS56117175A (en) 1980-02-20 1980-02-20 Screening device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011880A JPS56117175A (en) 1980-02-20 1980-02-20 Screening device

Publications (1)

Publication Number Publication Date
JPS56117175A true JPS56117175A (en) 1981-09-14

Family

ID=12018199

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011880A Pending JPS56117175A (en) 1980-02-20 1980-02-20 Screening device

Country Status (1)

Country Link
JP (1) JPS56117175A (en)

Similar Documents

Publication Publication Date Title
JPS5287329A (en) Mosfet integrated circuit chip
ATE71237T1 (en) COMPONENT IN CHIP CONSTRUCTION FOR MOUNTING ON A CIRCUIT BOARD, WITH AN ELECTRICAL OR ELECTRONIC FUNCTIONAL BODY.
EP0178227A3 (en) Integrated circuit semiconductor device formed on a wafer
GB2088635B (en) Encapsulation for semiconductor integrated circuit chip
EP0304263A3 (en) Semiconductor chip assembly
IE830584L (en) Dense mounting of semiconductor chip packages
EP0179577A3 (en) Method for making a semiconductor device having conductor pins
DE3370407D1 (en) Package for a semiconductor chip with lead terminals
FR2666931B1 (en)
EP0031240A3 (en) An electrical component comprising semiconductor chips
EP0182222A3 (en) Semiconductor integrated circuit device constructed by polycell technique
EP0192468A3 (en) Electronic package assembly and accessory component therefor
HK69493A (en) Process for fabricating a semiconductor integrated circuit device having misfets
JPS5212459A (en) Heattproof electrically conductive adhesives for ic chips
JPS5779652A (en) Resin-sealed semiconductor device
JPS56117175A (en) Screening device
JPS5230162A (en) Semiconductor device
EP0111181A3 (en) Semiconductor component with a contact hole
GB2202994B (en) Circuit assembly, e.g. for an electronic timepiece
JPS6489499A (en) Component chuck device
JPS5240972A (en) Packaging construction of semiconductor device
JPS5223273A (en) Method of manufacturing semiconductor element
JPS57100751A (en) Metallic container for semiconductor device
IT8319237A0 (en) PROCEDURE FOR THE MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES.
JPS52108774A (en) Fitting material for integrated circuit