JPS56115308A - Molding resin composition - Google Patents
Molding resin compositionInfo
- Publication number
- JPS56115308A JPS56115308A JP401580A JP401580A JPS56115308A JP S56115308 A JPS56115308 A JP S56115308A JP 401580 A JP401580 A JP 401580A JP 401580 A JP401580 A JP 401580A JP S56115308 A JPS56115308 A JP S56115308A
- Authority
- JP
- Japan
- Prior art keywords
- residue
- acid
- resin composition
- unsaturated
- compounding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Reinforced Plastic Materials (AREA)
- Polyurethanes Or Polyureas (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
PURPOSE: To prepare the titled novel resin composition having excellent mechanical strength, workability, thickening properties, etc., by compounding a specific unsaturated ester containing tricyclodecene residue and unsaturated dibasic acid residue, an isocyanate group-containing polybutadiene, and a monomer.
CONSTITUTION: The objective resin composition is prepared by compounding (A) an unsaturated ester obtained by reacting (i) a partially esterified carboxylic acid containing tricyclo [5,2,1,02,6]-4-decene-8(9) residue and unsaturated dibasic acid (e.g. maleic acid) residue as constituents (e.g. the compound of formula) with (ii) bisphenol-type epoxy resin and (iii) an unsaturated monobasic acid [e.g. methacrylic acid; excluding the component (i)], (B) polybutadiene having at least one isocyanate group in the molecule, and (C) a polymerizable monomer (e.g. styrene).
COPYRIGHT: (C)1981,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP401580A JPS56115308A (en) | 1980-01-16 | 1980-01-16 | Molding resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP401580A JPS56115308A (en) | 1980-01-16 | 1980-01-16 | Molding resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS56115308A true JPS56115308A (en) | 1981-09-10 |
JPS5740851B2 JPS5740851B2 (en) | 1982-08-31 |
Family
ID=11573137
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP401580A Granted JPS56115308A (en) | 1980-01-16 | 1980-01-16 | Molding resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS56115308A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4530962A (en) * | 1981-11-10 | 1985-07-23 | Scott Bader Company Limited | Elastomer modified unsaturated polymers |
US5185498A (en) * | 1991-06-11 | 1993-02-09 | Delco Electronics Corporation | Circuit assembly encapsulated with polybutadiene urethane |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6123060U (en) * | 1984-07-18 | 1986-02-10 | 株式会社日立ホームテック | Hot air heater control circuit |
-
1980
- 1980-01-16 JP JP401580A patent/JPS56115308A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4530962A (en) * | 1981-11-10 | 1985-07-23 | Scott Bader Company Limited | Elastomer modified unsaturated polymers |
US5185498A (en) * | 1991-06-11 | 1993-02-09 | Delco Electronics Corporation | Circuit assembly encapsulated with polybutadiene urethane |
Also Published As
Publication number | Publication date |
---|---|
JPS5740851B2 (en) | 1982-08-31 |
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